型號: | IDT54FCT827DTEB |
廠商: | INTEGRATED DEVICE TECHNOLOGY INC |
元件分類: | 通用總線功能 |
英文描述: | Ceramic Chip Capacitors / Standard X7R; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 200V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R; Lead Style: Surface Mount Chip; Lead Dimensions: 1812; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.177" x 0.126"; Container: Bulk; Features: Unmarked |
中文描述: | FCT SERIES, 10-BIT DRIVER, TRUE OUTPUT, CDFP24 |
封裝: | CERPACK-24 |
文件頁數(shù): | 6/7頁 |
文件大小: | 127K |
代理商: | IDT54FCT827DTEB |
相關(guān)PDF資料 |
PDF描述 |
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IDT54FCT827DTL | FAST CMOS 10-BIT BUFFERS |
IDT54FCT827DTLB | Ceramic Chip Capacitors / Standard X7R; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 50V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R; Lead Style: Surface Mount Chip; Lead Dimensions: 1812; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.177" x 0.126"; Container: Bulk; Features: Unmarked |
IDT54FCT827DTP | FAST CMOS 10-BIT BUFFERS |
IDT54FCT827DTPB | Ceramic Chip Capacitors / Standard X7R; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R; Lead Style: Surface Mount Chip; Lead Dimensions: 1812; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.177" x 0.126"; Container: Bulk; Features: Unmarked |
IDT54FCT827DTPY | FAST CMOS 10-BIT BUFFERS |
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