參數(shù)資料
型號: IDT71V25761S183BG
廠商: INTEGRATED DEVICE TECHNOLOGY INC
元件分類: DRAM
英文描述: 128K X 36, 256K X 18 3.3V Synchronous SRAMs 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect
中文描述: 128K X 36 CACHE SRAM, 3.3 ns, PBGA119
封裝: BGA-119
文件頁數(shù): 1/23頁
文件大?。?/td> 526K
代理商: IDT71V25761S183BG
OCTOBER 2000
DSC-5297/01
1
2000 Integrated Device Technology, Inc.
Features
N
128K x 36, 256K x 18 memory configurations
N
Supports high system speed:
Commercial:
– 200MHz 3.1ns clock access time
Commercial and Industrial:
– 183MHz 3.3ns clock access time
– 166MHz 3.5ns clock access time
N
LBO
input selects interleaved or linear burst mode
N
Self-timed write cycle with global write control (
GW
), byte write
enable (
BWE
), and byte writes (
BW
x)
N
3.3V core power supply
N
Power down controlled by ZZ input
N
2.5V I/O
N
Packaged in a JEDEC Standard 100-pin plastic thin quad
flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch ball
grid array
Description
The IDT71V25761/781 are high-speed SRAMs organized as 128K
x 36/256K x 18. The IDT71V25761/781 SRAMs contain write, data,
address and control registers. Internal logic allows the SRAMto generate
a self-timed write based upon a decision which can be left until the end of
the write cycle.
The burst mode feature offers the highest level of performance to the
systemdesigner, as the IDT71V25761/718 can provide four cycles of data
for a single address presented to the SRAM. An internal burst address
counter accepts the first cycle address fromthe processor, initiating the
access sequence. The first cycle of output data will be pipelined for one
cycle before it is available on the next rising clock edge. If burst mode
operation is selected (
ADV
=LOW), the subsequent three cycles of output
data will be available to the user on the next three rising clock edges. The
order of these three addresses are defined by the internal burst counter
and the
LBO
input pin.
The IDT71V25761/781 SRAMs utilize IDT’s latest high-performance
CMOS process and are packaged in a JEDEC standard 14mmx 20mm
100-pin thin plastic quad flatpack (TQFP) as well as a 119 ball grid array
(BGA) and 165 fine pitch ball grid array (fBGA).
Pin Description Summary
NOTE:
1.
BW
3
and
BW
4
are not applicable for the IDT71V25781.
A
0
-A
17
Address Inputs
Input
Synchronous
CE
Chip Enable
Input
Synchronous
CS
0
,
CS
1
Chip Selects
Input
Synchronous
OE
Output Enable
Input
Asynchronous
GW
Global Write Enable
Input
Synchronous
BWE
Byte Write Enable
Input
Synchronous
BW
1
,
BW
2
,
BW
3
,
BW
4
(1)
Individual Byte Write Selects
Input
Synchronous
CLK
Clock
Input
N/A
ADV
Burst Address Advance
Input
Synchronous
ADSC
Address Status (Cache Controller)
Input
Synchronous
ADSP
Address Status (Processor)
Input
Synchronous
LBO
Linear / Interleaved Burst Order
Input
DC
ZZ
Sleep Mode
Input
Asynchronous
I/O
0
-I/O
31
, I/O
P1
-I/O
P4
Data Input / Output
I/O
Synchronous
V
DD
, V
DDQ
Core Power I/O Power
Supply
N/A
V
SS
Ground
Supply
N/A
5297 tbl 01
128K X 36, 256K X 18
3.3V Synchronous SRAMs
2.5V I/O, Pipelined Outputs,
Burst Counter, Single Cycle Deselect
IDT71V25761
IDT71V25781
相關(guān)PDF資料
PDF描述
IDT71V25761S183BGI 128K X 36, 256K X 18 3.3V Synchronous SRAMs 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect
IDT71V25761S183BQ 128K X 36, 256K X 18 3.3V Synchronous SRAMs 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect
IDT71V25761S183BQI 128K X 36, 256K X 18 3.3V Synchronous SRAMs 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect
IDT71V25761S183PF 128K X 36, 256K X 18 3.3V Synchronous SRAMs 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect
IDT71V25761S183PFI 128K X 36, 256K X 18 3.3V Synchronous SRAMs 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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IDT71V25761S183PF 功能描述:IC SRAM 4MBIT 183MHZ 100TQFP RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 產(chǎn)品變化通告:Product Discontinuation 05/Nov/2008 標(biāo)準(zhǔn)包裝:84 系列:- 格式 - 存儲器:RAM 存儲器類型:SRAM - 同步 ZBT 存儲容量:4.5M(128K x 36) 速度:75ns 接口:并聯(lián) 電源電壓:3.135 V ~ 3.465 V 工作溫度:-40°C ~ 85°C 封裝/外殼:119-BGA 供應(yīng)商設(shè)備封裝:119-PBGA(14x22) 包裝:托盤 其它名稱:71V3557SA75BGI
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