參數(shù)資料
型號(hào): IDT71V2576YSA150PFI
廠商: Integrated Device Technology, Inc.
元件分類: 通用總線功能
英文描述: 128K X 36, 256K X 18 3.3V Synchronous SRAMs 2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect
中文描述: 128K的米鼠36,256 × 18 3.3同步SRAM的2.5VI / O的流水線輸出,脈沖計(jì)數(shù)器,單周期取消
文件頁(yè)數(shù): 9/22頁(yè)
文件大?。?/td> 282K
代理商: IDT71V2576YSA150PFI
6.42
IDT71V2576, IDT71V2578, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with
2.5V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect Commercial and Industrial Temperature Ranges
9
DC Electrical Characteristics Over the Operating
Temperature and Supply Voltage Range
(1)
DC Electrical Characteristics Over the Operating
Temperature and Supply Voltage Range
(V
DD
= 3.3V ± 5%)
Figure 2. Lumped Capacitive Load, Typical Derating
Figure 1. AC Test Load
AC Test Load
AC Test Conditions
(V
DDQ
= 2.5V)
NOTE:
1. The
LBO
, TMS, TDI, TCK and TRST pins will be internally pulled to V
DD
and the ZZ pin will be internally pulled to V
SS
if they are not actively driven in the application.
NOTES:
1. All values are maximumguaranteed values.
2. At f = f
MAX,
inputs are cycling at the maximumfrequency of read cycles of 1/t
CYC
while
ADSC
= LOW; f=0 means no input lines are changing.
3. For I/Os V
HD
= V
DDQ
- 0.2V, V
LD
= 0.2V. For other inputs V
HD
= V
DD
- 0.2V, V
LD
= 0.2V.
V
DDQ
/2
50
I/O
Z
0
= 50
4876 drw 06
,
1
2
3
4
20 30 50
100
200
4876 drw 07
,
tCD
(Typical, ns)
Capacitance (pF)
80
5
6
Symbol
Parameter
Test Conditions
Min.
Max.
Unit
|
LI
|
Input Leakage Current
V
DD
= Max., V
IN
= 0V to V
DD
___
5
μA
|
LZZ
|
ZZ
LBO
and JTAG Input Leakage Current
(1)
V
DD
= Max., V
IN
= 0V to V
DD
___
30
μA
|
LO
|
Output Leakage Current
V
OUT
= 0V to V
DDQ
, Device Deselected
___
5
μA
V
OL
Output Low Voltage
I
OL
= +6mA, V
DD
= Min.
___
0.4
V
V
OH
Output High Voltage
I
OH
= -6mA, V
DD
= Min.
2.0
___
V
4876 tbl 08
Symbol
Parameter
Test Conditions
150MHz
133MHz
Unit
Com'l
Ind
Com'l
Ind
I
DD
Operating Power Supply
Current
Device Selected, Outputs Open, V
DD
= Max.,
V
DDQ
= Max., V
IN
> V
IH
or < V
IL
, f = f
MAX
(2)
295
305
250
260
mA
I
SB1
CMOS Standby Power
Supply Current
Device Deselected, Outputs Open, V
DD
= Max.,
V
DDQ
= Max., V
IN
> V
HD
or < V
LD
, f = 0
(2,3)
30
35
30
35
mA
I
SB2
Clock Running Power
Supply Current
Device Deselected, Outputs Open, V
DD
= Max.,
V
DDQ
= Max., V
IN
> V
HD
or < V
LD
, f = f
MAX
(2,3)
105
115
100
110
mA
I
ZZ
Full Sleep Mode Supply
Current
ZZ > V
HD
V
DD
= Max.
30
35
30
35
mA
4876 tbl 09
Input Pulse Levels
Input Rise/Fall Times
Input Timng Reference Levels
Output Timng Reference Levels
AC Test Load
0 to 2.5V
2ns
(V
DDQ
/2)
(V
DDQ
/2)
See Figure 1
4876 tbl 10
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