Figure 9. Half-Fu" />
參數資料
型號: IDT7200L15SO8
廠商: IDT, Integrated Device Technology Inc
文件頁數: 14/14頁
文件大?。?/td> 0K
描述: IC MEM FIFO 256X9 15NS 28-SOIC
標準包裝: 1,000
系列: 7200
功能: 異步
存儲容量: 2.3K(256 x 9)
數據速率: 40MHz
訪問時間: 15ns
電源電壓: 4.5 V ~ 5.5 V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 28-SOIC(0.345",8.77mm 寬)
供應商設備封裝: 28-SOIC
包裝: 帶卷 (TR)
其它名稱: 7200L15SO8
9
COMMERCIAL,INDUSTRIALANDMILITARY
TEMPERATURERANGES
IDT7201L/7201LA/7202LA CMOS ASYNCHRONOUS FIFO
256 x 9, 512 x 9 and 1,024 x 9
Figure 9. Half-Full Flag Timing
Figure 10. Expansion Out
Figure 11. Expansion In
OPERATING MODES:
Care must be taken to assure that the appropriate flag is monitored by
eachsystem(i.e.FFismonitoredonthedevicewhereWisused;EFismonitored
onthedevicewhereR isused).Foradditionalinformation,refertoTechNote
8: Operating FIFOs on Full and Empty Boundary Conditions and Tech Note
6: Designing with FIFOs.
SINGLE DEVICE MODE
A single IDT7200/7201A/7202A may be used when the application
requirements are for 256/512/1,024 words or less. These devices are in a
Single Device Configuration when the Expansion In (XI) control input is
grounded (see Figure 12).
DEPTH EXPANSION
The IDT7200/7201A/7202A can easily be adapted to applications when
the requirements are for greater than 256/512/1,024 words. Figure 14
demonstrates Depth Expansion using three IDT7200/7201A/7202As. Any
depthcanbeattainedbyaddingadditionalIDT7200/7201A/7202As. These
FIFOs operate in the Depth Expansion mode when the following conditions
are met:
1. ThefirstdevicemustbedesignatedbygroundingtheFirstLoad(FL)control
input.
2. All other devices must have FL in the HIGH state.
3. TheExpansionOut(XO)pinofeachdevicemustbetiedtotheExpansion
In (XI) pin of the next device. See Figure 14.
4. ExternallogicisneededtogenerateacompositeFullFlag(FF)andEmpty
Flag (EF). This requires the ORing of all EFs and ORing of all FFs (i.e.
all must be set to generate the correct composite FF or EF). See Figure
14.
5. TheRetransmit(RT)functionandHalf-FullFlag(HF)arenotavailablein
the Depth Expansion Mode.
For additional information, refer to Tech Note 9: Cascading FIFOs or
FIFO Modules.
R
W
HF
tRHF
HALF-FULL OR LESS
MORE THAN HALF-FULL
tWHF
2679 drw 11
HALF-FULL OR LESS
R
W
XO
2679 drw 12
WRITE TO
LAST PHYSICAL
LOCATION
tXOL
tXOH
READ FROM
LAST PHYSICAL
LOCATION
tXOL
tXOH
W
R
XI
WRITE TO
FIRST PHYSICAL
LOCATION
tXIS
READ FROM
FIRST PHYSICAL
LOCATION
tXIS
tXI
tXIR
2679 drw 13
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IDT7200L15SOGI 功能描述:IC MEM FIFO 256X9 15NS 28-SOIC RoHS:是 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:7200 標準包裝:80 系列:7200 功能:同步 存儲容量:18.4K(1K x 18) 數據速率:- 訪問時間:10ns 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:64-LQFP 供應商設備封裝:64-TQFP(10x10) 包裝:托盤 其它名稱:72225LB10TF
IDT7200L15SOGI8 功能描述:IC MEM FIFO 256X9 15NS 28-SOIC RoHS:是 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:7200 標準包裝:80 系列:7200 功能:同步 存儲容量:18.4K(1K x 18) 數據速率:- 訪問時間:10ns 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:64-LQFP 供應商設備封裝:64-TQFP(10x10) 包裝:托盤 其它名稱:72225LB10TF
IDT7200L15SOI 功能描述:IC MEM FIFO 256X9 15NS 28-SOIC RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:7200 標準包裝:80 系列:7200 功能:同步 存儲容量:18.4K(1K x 18) 數據速率:- 訪問時間:10ns 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:64-LQFP 供應商設備封裝:64-TQFP(10x10) 包裝:托盤 其它名稱:72225LB10TF
IDT7200L15SOI8 功能描述:IC MEM FIFO 256X9 15NS 28-SOIC RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:7200 標準包裝:80 系列:7200 功能:同步 存儲容量:18.4K(1K x 18) 數據速率:- 訪問時間:10ns 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:64-LQFP 供應商設備封裝:64-TQFP(10x10) 包裝:托盤 其它名稱:72225LB10TF
IDT7200L15TP 功能描述:IC MEM FIFO 256X9 15NS 28-PDIP RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:7200 標準包裝:80 系列:7200 功能:同步 存儲容量:18.4K(1K x 18) 數據速率:- 訪問時間:10ns 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:64-LQFP 供應商設備封裝:64-TQFP(10x10) 包裝:托盤 其它名稱:72225LB10TF