參數(shù)資料
型號: IDT72211L15PFGI8
廠商: IDT, Integrated Device Technology Inc
文件頁數(shù): 3/14頁
文件大?。?/td> 0K
描述: IC FIFO 512X9 SYNC 15NS 32-TQFP
標(biāo)準(zhǔn)包裝: 2,000
系列: 7200
功能: 同步
存儲容量: 4.6K(512 x 9)
訪問時(shí)間: 15ns
電源電壓: 4.5 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 32-LQFP
供應(yīng)商設(shè)備封裝: 32-TQFP(7x7)
包裝: 帶卷 (TR)
其它名稱: 72211L15PFGI8
11
COMMERCIALANDINDUSTRIAL
TEMPERATURERANGES
IDT72421/72201/72211/72221/72231/72241/72251 CMOS SyncFIFO
64 x 9, 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9 and 8,192 x 9
Figure 11. Programmable Empty Flag Timing
NOTES:
1. n = PAE offset.
2. tSKEW2 is the minimum time between a rising WCLK edge and a rising RCLK edge for PAE to change during that clock cycle. If the time between the rising edge of WCLK and
the rising edge of RCLK is less than tSKEW2, then PAE may not change state until the next RCLK rising edge.
3. If a read is performed on this rising edge of the Read Clock, there will be Empty + (n-1) words in the FIFO when PAE goes LOW.
NOTES:
1. m = PAF offset .
2. 64-m words in FIFO for IDT72421, 256-m words for IDT72201, 512-m words for IDT72211, 1,024-m words for IDT72221, 2,048-m words for IDT72231, 4,096-m words for IDT72241,
and 8,192-m words for IDT72251.
3. tSKEW2 is the minimum time between a rising RCLK edge and a rising WCLK edge for PAF to change during that clock cycle. If the time between the rising edge of RCLK and
the rising edge of WCLK is less than tSKEW2, then PAF may not change state until the next WCLK rising edge.
4. If a write is performed on this rising edge of the Write Clock, there will be Full - (m-1) words in the FIFO when PAF goes LOW.
Figure 10. Programmable Full Flag Timing
tENS
tENH
tENS
tENH
tENS
tENH
WCLK
WEN1
WEN2
(If Applicable)
PAF
RCLK
REN1,
REN2
(4)
(1)
tPAF
Full - (m+1) words in FIFO
Full - m words in FIFO
(2)
tCLKH
tCLKL
tSKEW2
(3)
tPAF
2655 drw 12
WCLK
WEN1
WEN2
PAE
RCLK
REN1,
REN2
tENS
tENH
tENS
tENH
tSKEW2
(2)
tENS
tENH
(If Applicable)
tPAE
(3)
(1)
n words in FIFO
n+1 words in FIFO
tCLKH
tCLKL
2655 drw 13
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