參數(shù)資料
型號(hào): IDT723644L12PF8
廠商: IDT, Integrated Device Technology Inc
文件頁(yè)數(shù): 10/35頁(yè)
文件大?。?/td> 0K
描述: IC FIFO SYNC 2048X36 128QFP
標(biāo)準(zhǔn)包裝: 1,000
系列: 7200
功能: 同步
存儲(chǔ)容量: 72K(2K x 36)
數(shù)據(jù)速率: 83MHz
訪問時(shí)間: 12ns
電源電壓: 4.5 V ~ 5.5 V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 128-LQFP
供應(yīng)商設(shè)備封裝: 128-TQFP(14x20)
包裝: 帶卷 (TR)
其它名稱: 723644L12PF8
18
COMMERCIALTEMPERATURERANGE
IDT723624/723634/723644 CMOS SyncBiFIFO WITH BUS-MATCHING
256 x 36 x 2, 512 x 36 x 2, 1,024 x 36 x 2
Figure 6. Serial Programming of the Almost-Full Flag and Almost-Empty Flag Offset Values (IDT Standard and FWFT Modes)
Figure 5. Parallel Programming of the Almost-Full Flag and Almost-Empty Flag Offset Values after Reset (IDT Standard and FWFT Modes)
NOTES:
1. tSKEW1 is the minimum time between the rising CLKA edge and a rising CLKB edge for
FFB/IRB to transition HIGH in the next cycle. If the time between the rising edge of CLKA
and rising edge of CLKB is less than tSKEW1, then
FFB/IRB may transition HIGH one CLKB cycle later than shown.
2. It is not necessary to program offset register bits on consecutive clock cycles. FIFO write attempts are ignored until
FFA/IRA and FFB/IRB is set HIGH.
3. Programmable offsets are written serially to the SD input in the order
AFA offset (Y1), AEB offset (X1), AFB offset (Y2), and AEA offset (X2).
NOTES:
1. tSKEW1 is the minimum time between the rising CLKA edge and a rising CLKB edge for
FFB/IRB to transition HIGH in the next cycle. If the time between the rising edge of CLKA
and rising edge of CLKB is less than tSKEW1, then
FFB/IRB may transition HIGH one CLKB cycle later than shown.
2.
CSA=LOW, W/RA=HIGH,MBA=LOW. It is not necessary to program offset register on consecutive clock cycles.
3270 drw07
CLKA
MRS1,
MRS2
FFA/IRA
CLKB
FFB/IRB
A0-A35
FS1,FS0
ENA
tFSH
tWFF
tENH
tENS2
tSKEW1
tDS
tDH
tWFF
4
0,0
AFA Offset
(Y1)
AEB Offset
(X1)
AFB Offset
(Y 2)
AEA Offset
(X 2)
First Word to FIFO1
12
(1)
tFSH
tFSS
SPM
tFSS
1
2
CLKA
FFA/IRA
tSENS
tSENH
FS0/SD(3)
tSPH
tSENS
tSENH
tFSS
tWFF
FS1/SEN
AEA Offset
(X2) LSB
tSDS
tSDH
tSDS
tSDH
AFA Offset
(Y1) MSB
MRS1,
MRS2
4
3270 drw08
tFSS
tFSH
CLKB
4
SPM
FFB/IRB
tWFF
tSKEW(1)
相關(guān)PDF資料
PDF描述
V300B36M250BG3 CONVERTER MOD DC/DC 36V 250W
MS27484E14B15SD CONN PLUG 15POS STRAIGHT W/SCKT
MS27508E12F35SC CONN RCPT 22POS BOX MNT W/SCKT
IDT72615L25J IC FIFO BY SYNC 512X18X2 68PLCC
MAX1031BCEG+ IC ADC 10BIT 300KSPS 24-QSOP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
IDT723644L15PF 功能描述:IC FIFO SYNC 2048X36 128QFP RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:7200 標(biāo)準(zhǔn)包裝:15 系列:74F 功能:異步 存儲(chǔ)容量:256(64 x 4) 數(shù)據(jù)速率:- 訪問時(shí)間:- 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:通孔 封裝/外殼:24-DIP(0.300",7.62mm) 供應(yīng)商設(shè)備封裝:24-PDIP 包裝:管件 其它名稱:74F433
IDT723644L15PF8 功能描述:IC FIFO SYNC 2048X36 128QFP RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:7200 標(biāo)準(zhǔn)包裝:15 系列:74F 功能:異步 存儲(chǔ)容量:256(64 x 4) 數(shù)據(jù)速率:- 訪問時(shí)間:- 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:通孔 封裝/外殼:24-DIP(0.300",7.62mm) 供應(yīng)商設(shè)備封裝:24-PDIP 包裝:管件 其它名稱:74F433
IDT723646L12PF 功能描述:IC FIFO SYNC 2048X36 128QFP RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:7200 標(biāo)準(zhǔn)包裝:15 系列:74F 功能:異步 存儲(chǔ)容量:256(64 x 4) 數(shù)據(jù)速率:- 訪問時(shí)間:- 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:通孔 封裝/外殼:24-DIP(0.300",7.62mm) 供應(yīng)商設(shè)備封裝:24-PDIP 包裝:管件 其它名稱:74F433
IDT723646L12PF8 功能描述:IC FIFO SYNC 2048X36 128QFP RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:7200 標(biāo)準(zhǔn)包裝:15 系列:74F 功能:異步 存儲(chǔ)容量:256(64 x 4) 數(shù)據(jù)速率:- 訪問時(shí)間:- 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:通孔 封裝/外殼:24-DIP(0.300",7.62mm) 供應(yīng)商設(shè)備封裝:24-PDIP 包裝:管件 其它名稱:74F433
IDT723646L15PF 功能描述:IC FIFO SYNC 2048X36 128QFP RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:7200 標(biāo)準(zhǔn)包裝:15 系列:74F 功能:異步 存儲(chǔ)容量:256(64 x 4) 數(shù)據(jù)速率:- 訪問時(shí)間:- 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:通孔 封裝/外殼:24-DIP(0.300",7.62mm) 供應(yīng)商設(shè)備封裝:24-PDIP 包裝:管件 其它名稱:74F433