參數(shù)資料
型號(hào)： IDT72T3685L7BBI
廠商： Integrated Device Technology, Inc.
英文描述： 2.5 VOLT HIGH-SPEED TeraSyncTM FIFO 36-BIT CONFIGURATIONS
中文描述： 2.5伏高速TeraSyncTM FIFO的36位配置
文件頁(yè)數(shù)： 56/57頁(yè)
文件大?。?/td> 556K
代理商： IDT72T3685L7BBI
56
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync
36-BIT FIFO
1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
DEPTH EXPANSION CONFIGURATION (FWFT MODE ONLY)
The IDT72T3645 can easily be adapted to applications requiring depths
greater than 1,024, 2,048 for the IDT72T3655, 4,096 for the IDT72T3665,
8,192 for the IDT72T3675, 16,384 for the IDT72T3685, 32,768 for the
IDT72T3695, 65,536 for the IDT72T36105, 131,072 for the IDT72T36115
and 262,144 for the IDT72T36125 with an 18-bit bus width. In FWFT mode,
the FIFOs can be connected in series (the data outputs of one FIFO connected
to the data inputs of the next) with no external logic necessary. The resulting
configuration provides a total depth equivalent to the sumof the depths
associated with each single FIFO. Figure 37 shows a depth expansion using
two IDT72T3645/72T3655/72T3665/72T3675/72T3685/72T3695/
72T36105/72T36115/72T36125 devices.
Care should be taken to select FWFT mode during Master Reset for all FIFOs
in the depth expansion configuration. The first word written to an empty
configuration will pass fromone FIFO to the next ("ripple down") until it finally
appears at the outputs of the last FIFO in the chain – no read operation is
necessary but the RCLK of each FIFO must be free-running. Each time the
data word appears at the outputs of one FIFO, that device's
OR
line goes LOW,
enabling a write to the next FIFO in line.
For an empty expansion configuration, the amount of time it takes for
OR
of
the last FIFO in the chain to go LOW (i.e. valid data to appear on the last FIFO's
outputs) after a word has been written to the first FIFO is the sumof the delays
for each individual FIFO:
(N – 1)*4*transfer clock) + 3*T
RCLK
where N is the number of FIFOs in the expansion and T
RCLK
is the RCLK
period. Note that extra cycles should be added for the possibility that the t
SKEW1
specification is not met between WCLK and transfer clock, or RCLK and transfer
clock, for the
OR
flag.
The "ripple down" delay is only noticeable for the first word written to an empty
depth expansion configuration. There will be no delay evident for subsequent
words written to the configuration.
The first free location created by reading froma full depth expansion
configuration will "bubble up" fromthe last FIFO to the previous one until it finally
moves into the first FIFO of the chain. Each time a free location is created in one
FIFO of the chain, that FIFO's
IR
line goes LOW, enabling the preceding FIFO
to write a word to fill it.
For a full expansion configuration, the amount of time it takes for
IR
of the first
FIFO in the chain to go LOW after a word has been read fromthe last FIFO is
the sumof the delays for each individual FIFO:
(N – 1)*3*transfer clock) + 2 T
WCLK
where N is the number of FIFOs in the expansion and T
WCLK
is the WCLK
period. Note that extra cycles should be added for the possibility that the t
SKEW1
specification is not met between RCLK and transfer clock, or WCLK and transfer
clock, for the
IR
flag.
The Transfer Clock line should be tied to either WCLK or RCLK, whichever
is faster. Both these actions result in data moving, as quickly as possible, to the
end of the chain and free locations to the beginning of the chain.
Figure 37. Block Diagram of 2,048 x 36, 4,096 x 36, 8,192 x 36, 16,384 x 36, 32,768 x 36, 65,536 x 36, 131,072 x 36, 262,144 x 36 and 524,288 x 36
Depth Expansion
Dn
INPUT READY
WRITE ENABLE
WRITE CLOCK
WEN
WCLK
IR
DATA IN
RCLK
READ CLOCK
RCLK
REN
OE
OUTPUT ENABLE
OUTPUT READY
Qn
Dn
IR
GND
n
WEN
WCLK
OR
REN
OE
Qn
READ ENABLE
OR
DATA OUT
TRANSFER CLOCK
5907 drw42
n
n
FWFT/SI
FWFT/SI
FWFT/SI
IDT
72T3645
72T3655
72T3665
72T3675
72T3685
72T3695
72T36105
72T36115
72T36125
RCS
READ CHIP SELECT
RCS
IDT
72T3645
72T3655
72T3665
72T3675
72T3685
72T3695
72T36105
72T36115
72T36125
相關(guān)PDF資料
PDF描述
IDT72T3695L7BBI 2.5 VOLT HIGH-SPEED TeraSyncTM FIFO 36-BIT CONFIGURATIONS
IDT72T36115L7BBI SWITCH ROLLER LEVER
IDT72T36125L7BBI SWITCH ROLLER LEVER
IDT72T3655L6BB 2.5 VOLT HIGH-SPEED TeraSyncTM FIFO 36-BIT CONFIGURATIONS
IDT72T3685L6BB 2.5 VOLT HIGH-SPEED TeraSyncTM FIFO 36-BIT CONFIGURATIONS
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
IDT72T3695L4-4BB 功能描述:IC FIFO 32768X36 4-4NS 208BGA RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:72T 標(biāo)準(zhǔn)包裝:15 系列:74F 功能:異步 存儲(chǔ)容量:256（64 x 4） 數(shù)據(jù)速率:- 訪問(wèn)時(shí)間:- 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:通孔 封裝/外殼:24-DIP（0.300"，7.62mm） 供應(yīng)商設(shè)備封裝:24-PDIP 包裝:管件 其它名稱:74F433
IDT72T3695L5BB 功能描述:IC FIFO 32768X36 5NS 208BGA RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:72T 標(biāo)準(zhǔn)包裝:15 系列:74F 功能:異步 存儲(chǔ)容量:256（64 x 4） 數(shù)據(jù)速率:- 訪問(wèn)時(shí)間:- 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:通孔 封裝/外殼:24-DIP（0.300"，7.62mm） 供應(yīng)商設(shè)備封裝:24-PDIP 包裝:管件 其它名稱:74F433
IDT72T3695L5BBI 功能描述:IC FIFO 32768X36 5NS 208BGA RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:72T 標(biāo)準(zhǔn)包裝:15 系列:74F 功能:異步 存儲(chǔ)容量:256（64 x 4） 數(shù)據(jù)速率:- 訪問(wèn)時(shí)間:- 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:通孔 封裝/外殼:24-DIP（0.300"，7.62mm） 供應(yīng)商設(shè)備封裝:24-PDIP 包裝:管件 其它名稱:74F433
IDT72T3695L6-7BB 功能描述:IC FIFO 32768X36 6-7NS 208BGA RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:72T 標(biāo)準(zhǔn)包裝:15 系列:74F 功能:異步 存儲(chǔ)容量:256（64 x 4） 數(shù)據(jù)速率:- 訪問(wèn)時(shí)間:- 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:通孔 封裝/外殼:24-DIP（0.300"，7.62mm） 供應(yīng)商設(shè)備封裝:24-PDIP 包裝:管件 其它名稱:74F433
IDT72T40108L10BB 功能描述:IC FIFO DDR/SDR 10NS 208-BGA RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:72T 標(biāo)準(zhǔn)包裝:15 系列:74F 功能:異步 存儲(chǔ)容量:256（64 x 4） 數(shù)據(jù)速率:- 訪問(wèn)時(shí)間:- 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:通孔 封裝/外殼:24-DIP（0.300"，7.62mm） 供應(yīng)商設(shè)備封裝:24-PDIP 包裝:管件 其它名稱:74F433
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