IDT72V205/72V215/72V225/72V235/72V245 3.3V CMOS SyncFIFOTM 256 x 18, 512 x 18, 1,024 x 18, 2,048 x 1" />
參數(shù)資料
型號: IDT72V245L15PF
廠商: IDT, Integrated Device Technology Inc
文件頁數(shù): 17/25頁
文件大?。?/td> 0K
描述: IC FIFO SYNC 4KX18 15NS 64QFP
標(biāo)準(zhǔn)包裝: 90
系列: 72V
功能: 同步
存儲容量: 72K(4K x 18)
訪問時間: 15ns
電源電壓: 3 V ~ 3.6 V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 64-LQFP
供應(yīng)商設(shè)備封裝: 64-TQFP(14x14)
包裝: 托盤
其它名稱: 72V245L15PF
24
IDT72V205/72V215/72V225/72V235/72V245 3.3V CMOS SyncFIFOTM
256 x 18, 512 x 18, 1,024 x 18, 2,048 x 18 and 4,096 x 18
COMMERCIALANDINDUSTRIAL
TEMPERATURERANGES
MARCH 2013
Figure 31. Block Diagram of 512 x 18, 1,024 x 18, 2,048 x 18, 4,096 x 18, 8,192 x 18
Synchronous FIFO Memory With Programmable Flags used in Depth Expansion Configuration
Dn
INPUT READY
WRITE ENABLE
WRITE CLOCK
WEN
WCLK
IR
DATA IN
RCLK
READ CLOCK
RCLK
REN
OE OUTPUT ENABLE
OUTPUT READY
Qn
Dn
IR
GND
WEN
WCLK
OR
REN
OE
Qn
READ ENABLE
OR
DATA OUT
TRANSFER CLOCK
4294 drw 31
n
RXI
HF
72V205
72V215
72V225
72V235
72V245
WXI
FL
VCC
GND
(0,1)
72V205
72V215
72V225
72V235
72V245
RXI
WXI
FL
VCC
GND
(0,1)
PAF
HF
PAE
n
DEPTH EXPANSION CONFIGURATION (FWFT MODE)
In FWFT mode, the FIFOs can be connected in series (the data outputs of
one FIFO connected to the data inputs of the next) with no external logic
necessary. Theresultingconfigurationprovidesatotaldepthequivalenttothe
sumofthedepthsassociatedwitheachsingleFIFO. Figure31showsadepth
expansionusingtwoIDT72V205/72V215/72V225/72V235/72V245devices.
CareshouldbetakentoselectFWFTmodeduringMasterResetforallFIFOs
in the depth expansion configuration. The first word written to an empty
configuration will pass from one FIFO to the next (“ripple down”) until it finally
appears at the outputs of the last FIFO in the chain–no read operation is
necessarybuttheRCLKofeachFIFOmustbefree-running. Eachtimethedata
word appears at the outputs of one FIFO, that device’s OR line goes LOW,
enabling a write to the next FIFO in line.
Foranemptyexpansionconfiguration,theamountoftimeittakesforORof
thelastFIFOinthechaintogoLOW(i.e.validdatatoappearonthelastFIFO’s
outputs)afterawordhasbeenwrittentothefirstFIFOisthesumofthedelays
for each individual FIFO:
(N – 1)*(4*transfer clock) + 3*TRCLK
whereNisthenumberofFIFOsintheexpansionandTRCLKistheRCLKperiod.
Note that extra cycles should be added for the possibility that the tSKEW1
specificationisnotmetbetweenWCLKandtransferclock,orRCLKandtransfer
clock,fortheORflag.
The“rippledown”delayisonlynoticeableforthefirstwordwrittentoanempty
depthexpansionconfiguration. Therewillbenodelayevidentforsubsequent
wordswrittentotheconfiguration.
The first free location created by reading from a full depth expansion
configurationwill“bubbleup”fromthelastFIFOtothepreviousoneuntilitfinally
movesintothefirstFIFOofthechain. Eachtimeafreelocationiscreatedinone
FIFOofthechain,thatFIFO’sIRlinegoesLOW,enablingtheprecedingFIFO
to write a word to fill it.
Forafullexpansionconfiguration,theamountoftimeittakesforIRofthefirst
FIFOinthechaintogoLOWafterawordhasbeenreadfromthelastFIFO is
the sum of the delays for each individual FIFO:
(N – 1)*(3*transfer clock) + 2 TWCLK
where N is the number of FIFOs in the expansion and TWCLK is the WCLK
period. NotethatextracyclesshouldbeaddedforthepossibilitythatthetSKEW1
specificationisnotmetbetweenRCLKandtransferclock,orWCLKandtransfer
clock, for the IRflag.
TheTransferClocklineshouldbetiedtoeitherWCLKorRCLK,whichever
isfaster. Boththeseactionsresultindatamoving,asquicklyaspossible,tothe
end of the chain and free locations to the beginning of the chain.
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