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參數(shù)資料
| 型號(hào)： | IDT72V811L10TFG |
| 廠商： | IDT, Integrated Device Technology Inc |
| 文件頁(yè)數(shù)： | 4/16頁(yè) |
| 文件大小： | 0K |
| 描述： | IC FIFO 512X9 SYNC DUAL 64TQFP |
| 標(biāo)準(zhǔn)包裝： | 80 |
| 系列： | 72V |
| 功能： | 異步 |
| 存儲(chǔ)容量： | 4.6K（512 x 9） |
| 數(shù)據(jù)速率： | 100MHz |
| 訪問(wèn)時(shí)間： | 10ns |
| 電源電壓： | 3 V ~ 3.6 V |
| 工作溫度： | 0°C ~ 70°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 64-LQFP |
| 供應(yīng)商設(shè)備封裝： | 64-TQFP（10x10） |
| 包裝： | 托盤 |
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IDT72V801/72V8211/72V821/72V831/72V841/72V851 3.3V DUAL CMOS SyncFIFOTM
DUAL 256 x 9, DUAL 512 x 9, DUAL 1K x 9, DUAL 2K x 9, DUAL 4K x 9, DUAL 8K x 9
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
OCTOBER 22, 2008
NOTES:
1. m =
PAF offset.
2. (256-m) words for the IDT72V801, (512-m) words the IDT72V811, (1,024-m) words for the IDT72V821, (2,048-m) words for the IDT72V831, (4,096-m) words for the IDT72V841,
or (8,192-m) words for the IDT72V851.
3. tSKEW2 is the minimum time between a rising RCLKA (RCLKB) edge and a rising WCLKA (WCLKB) edge for
PAFA (PAFB) to change during that clock cycle. If the time between
the rising edge of RCLKA (RCLKB) and the rising edge of WCLKA (WCLKB) is less than tSKEW2, then
PAFA (PAFB) may not change state until the next WCLKA (WCLKB)
rising edge.
4. If a write is performed on this rising edge of the Write Clock, there will be Full - (m-1) words in FIFO A (B) when
PAFA (PAFB) goes LOW.
Figure 10. Programmable Full Flag Timing
Figure 11. Programmable Empty Flag Timing
NOTES:
1. n =
PAE offset.
2. tSKEW2 is the minimum time between a rising WCLKA (WCLKB) edge and a rising RCLKA (RCLKB) edge for
PAEA (PAEB) to change during that clock cycle. If the time between
the rising edge of WCLKA (WCLKB) and the rising edge of RCLKA (RCLKB) is less than tSKEW2, then
PAEA (PAEB) may not change state until the next RCLKA (RCLKB)
rising edge.
3. If a read is performed on this rising edge of the Read Clock, there will be Empty + (n-1) words in FIFO A (B) when
PAEA (PAEB) goes LOW.
tENS
tENH
tENS
tENH
tENS
tENH
WCLKA
(WCLKB)
WENA1
(WENB1
WENA2
(WENB2)
(If Applicable)
PAFA
(PAFB)
RCLKA
(RCLKB)
RENA1, RENA2
(RENB1, RENB2)
(4)
tPAF
(1)
Full - (m+1) words in FIFO
Full - m words in FIFO
(2)
tCLKH
tCLKL
tSKEW2
(3)
tPAF
4093 drw 12
WCLKA
(WCLKB)
WENA1
(WENB1)
WENA2
(WENB2)
(If Applicable)
PAEA,
PAEB
RCLKA
(RCLKB)
RENA1, RENA2
(RENB1, RENB2)
tENS
tENH
tENS
tENH
tSKEW2(2)
tENS
tENH
tPAE
(3)
(1)
n words in FIFO
n+1 words in FIFO
tCLKH
tCLKL
4093 drw 13
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| IDT72V811L10TFG8 | 制造商:Integrated Device Technology Inc 功能描述:IC FIFO SYNC 512X9 10NS 64QFP |
| IDT72V811L15PF | 功能描述:IC FIFO SYNC 512X9 15NS 64QFP RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:72V 標(biāo)準(zhǔn)包裝:90 系列:7200 功能:同步 存儲(chǔ)容量:288K（16K x 18） 數(shù)據(jù)速率:100MHz 訪問(wèn)時(shí)間:10ns 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:64-LQFP 供應(yīng)商設(shè)備封裝:64-TQFP（14x14） 包裝:托盤 其它名稱:72271LA10PF |
| IDT72V811L15PF8 | 功能描述:IC FIFO SYNC 512X9 15NS 64QFP RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:72V 標(biāo)準(zhǔn)包裝:90 系列:7200 功能:同步 存儲(chǔ)容量:288K（16K x 18） 數(shù)據(jù)速率:100MHz 訪問(wèn)時(shí)間:10ns 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:64-LQFP 供應(yīng)商設(shè)備封裝:64-TQFP（14x14） 包裝:托盤 其它名稱:72271LA10PF |
| IDT72V811L15PFGI | 制造商:Integrated Device Technology Inc 功能描述:IC FIFO SYNC 512X9 15NS 64QFP |
| IDT72V811L15PFI | 功能描述:IC FIFO SYNC 512X9 15NS 64QFP RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:72V 標(biāo)準(zhǔn)包裝:90 系列:7200 功能:同步 存儲(chǔ)容量:288K（16K x 18） 數(shù)據(jù)速率:100MHz 訪問(wèn)時(shí)間:10ns 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:64-LQFP 供應(yīng)商設(shè)備封裝:64-TQFP（14x14） 包裝:托盤 其它名稱:72271LA10PF |
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