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參數(shù)資料
| 型號(hào)： | IL3485E |
| 廠商： | NVE Corp/Isolation Products |
| 文件頁(yè)數(shù)： | 8/18頁(yè) |
| 文件大小： | 0K |
| 描述： | TXRX ISO BUS 20MBPS RS485 16SOIC |
| 產(chǎn)品培訓(xùn)模塊： | IsoLoop® Isolator |
| 標(biāo)準(zhǔn)包裝： | 50 |
| 系列： | IsoLoop® |
| 類型： | 收發(fā)器，隔離式 |
| 驅(qū)動(dòng)器/接收器數(shù)： | 1/1 |
| 規(guī)程： | RS485 |
| 電源電壓： | 3 V ~ 5.5 V，4.5 V ~ 5.5 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-SOIC（0.295"，7.50mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 16-SOIC |
| 包裝： | 管件 |
| 其它名稱： | 390-1099-5 |
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IL3485/IL3422
16
NVE Corporation
11409 Valley View Road, Eden Prairie, MN 55344-3617
Phone: (952) 829-9217
Fax: (952) 829-9189
www.IsoLoop.com
NVE Corporation
Revision History
ISB-DS-001 IL3485/22-P
November 2013
Changes
IEC 60747-5-5 (VDE 0884) certification.
Upgraded from MSL 2 to MSL 1.
Rearranged low level input current specifications so maximum is more than minimum.
ISB-DS-001 IL3485/22-O
Changes
Added VDE 0884 pending.
Clarified switching specifications.
Updated package drawings.\
Added recommended solder pad layouts.
ISB-DS-001 IL3485/22-N
Changes
Detailed isolation and barrier specifications.
Cosmetic changes.
ISB-DS-001-IL3485/22-M
Changes
Added minimum/maximum coil resistance specifications.
Misc. cosmetic changes.
ISB-DS-001-IL3485/22-L
Changes
Update terms and conditions.
ISB-DS-001-IL3485/22-K
Changes
Clarified ground pin connections (pp. 3-4).
ISB-DS-001-IL3485/22-J
Changes
Changes to current-limiting resistor values (pp. 7 and 10).
Details for boost capacitor selection (p. 7).
ISB-DS-001-IL3485/22-I
Change
Noted UL1577 approval.
ISB-DS-001-IL3485/22-H
Change
Added bus-protection ESD specification (15 kV).
ISB-DS-001-IL3485/22-G
Changes
Added typical coil resistance and temperature coefficient specifications.
Added note on package drawings that pin-spacing tolerances are non-accumulating.
ISB-DS-001-IL3485/22-F
Changes
Changed ordering information to reflect that devices are now fully RoHS compliant with
no exemptions.
ISB-DS-001-IL3485/22-E
Changes
Eliminated soldering profile chart
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