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Intel386 SXSA EMBEDDED MICROPROCESSOR
7
3.0
DESIGN CONSIDERATIONS
This section describes the Static Intel386 SXSA
microprocessor instruction set, component and
revision identifier, and package thermal specifica-
tions.
3.1.
Instruction Set
The Static Intel386 SXSA microprocessor uses the
same instruction set as the dynamic Intel386 SX
microprocessor. However, the Static Intel386 SXSA
microprocessor requires more clock cycles than the
dynamic Intel386 SX microprocessor to execute
some instructions. Table 4 lists these instructions
and the Static Intel386 SXSA microprocessor
execution times. For the equivalent dynamic
Intel386 SX microprocessor execution times, refer
to the “Instruction Set Clock Count Summary” table
in the Intel386 SX Microprocessordata sheet
(order number 240187).
3.2.
Component and Revision
Identifier
To assist users, the microprocessor holds a
component identifier and revision identifier in its DX
register after reset. The upper 8 bits of DX hold the
component identifier, 23H. (The lower nibble, 3H,
identifies the Intel386 architecture, while the upper
nibble, 2H, identifies the second member of the
Intel386 microprocessor family.)
The lower 8 bits of DX hold the revision level
identifier. The revision identifier will, in general,
chronologically track those component steppings
that are intended to have certain improvements or
distinction from previous steppings. The revision
identifier will track that of the Intel386 CPU
whenever possible. However, the revision identifier
value is not guaranteed to change with every
stepping revision or to follow a completely uniform
numerical sequence, depending on the type or
intent of the revision or the manufacturing materials
required to be changed. Intel has sole discretion
over these characteristics of the component. The
initial revision identifier for the Static Intel386 SXSA
microprocessor is 09H.
3.3.
Package Thermal Specifications
Static Intel386 SXSA microprocessor is specified
for operation with case temperature (T
) as
specified in the “DC SPECIFICATIONS” on page 9.
The case temperature can be measured in any
environment to determine whether the micropro-
cessor is within the specified operating range. The
case temperature should be measured at the center
of the top surface opposite the pins.
An increase in the ambient temperature (T
) causes
a proportional increase in the case temperature
(T
) and the junction temperature (T
). See
Figures 3 and Figures 4 for case and ambient
temperature relationships to frequency. A packaged
device produces thermal resistance between
junction and case temperatures (
θ
) and between
junction and ambient temperatures (
θ
). The
relationships between the temperature and thermal
resistance parameters are expressed by these
equations (P = power dissipated as heat = V
CC
×
I
CC
):
1.
T
J
= T
CASE
+ P
×
θ
JC
2.
T
A
= T
J
– P
×
θ
JA
3.
T
CASE
= T
A
+ P
×
[
θ
JA
–
θ
JC
]
A safe operating temperature can be calculated
from equation 1 by using the maximum safe T
of
115
°
C, the maximum power drawn by the chip in
the specific design, and the
θ
value from Table 3.
The
θ
A
value depends on the airflow (measured at
the top of the chip) provided by the system venti-
lation. The
θ
A
values are given for reference only
and are not guaranteed.
Table 3. Thermal Resistances (0°C/W)
θ
JA
,
θ
JC
Pkg
θ
JC
θ
JA
versus Airflow (ft/min)
0
100
200
100 PQFP
5.1
46.0
44.8
41.2