參數(shù)資料
型號： IP4365CX11
廠商： NXP Semiconductors N.V.
元件分類： 電路保護(hù)
英文描述： Integrated (U)SIM card passive filter array and USB full speed ESD protection to IEC 61000-4-2 level 4
封裝： IP4365CX11/P<OL-IP4365CX11 (WLCSP)|<<http://www.nxp.com/packages/OL-IP4365CX11.html<1<Always Pb-free,;
文件頁數(shù)： 8/12頁
文件大?。?/td> 236K
代理商： IP4365CX11
IP4365CX11_1
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 — 26 March 2010
8 of 12
NXP Semiconductors
IP4365CX11
Integrated SIM card passive filter array and USB ESD protection
9. Design and assembly recommendations
9.1 PCB design guidelines
For optimum performance it is recommended to use a Non-Solder Mask Defined (NSMD),
also known as a copper-defined design, incorporating laser-drilled micro-vias connecting
the ground pads to a buried ground-plane layer. This results in the lowest possible ground
inductance and provides the best high frequency and ESD performance. For this case,
refer to
Table 6
for the recommended PCB design parameters.
Table 6.
Parameter
PCB pad diameter
Micro-via diameter
Solder mask aperture diameter
Copper thickness
Copper finish
PCB material
9.2 PCB assembly guidelines for Pb-free soldering
Table 7.
Parameter
Solder screen aperture diameter
Solder screen thickness
Solder paste: Pb-free
Solder / flux ratio
Solder reflow profile
Recommended PCB design parameters
Value or specification
200
μ
m
100
μ
m (0.004 inch)
370
μ
m
20
μ
m to 40
μ
m
AuNi
FR4
Assembly recommendations
Value or specification
330
μ
m
100
μ
m (0.004 inch)
SnAg (3 % to 4 %) Cu (0.5 % to 0.9 %)
50 / 50
see
Figure 9
The device is capable of withstanding at least three reflows of this profile.
Fig 9.
Pb-free solder reflow profile
001aai943
T
reflow(peak)
250
230
217
T
(
°
C)
cooling rate
pre-heat
t
1
t
5
t
4
t
3
t
2
t (s)
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
IP4365CX11/P 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Integrated (U)SIM card passive filter array and USB full speed ESD protection to IEC 61000-4-2 level 4
IP4365CX11/P,135 制造商:NXP Semiconductors 功能描述:EMI Filter 800MHz to 3000MHz Flat Style SMD T/R 制造商:NXP Semiconductors 功能描述:IP4365CX11/NONE/REELLG//P - Tape and Reel 制造商:NXP Semiconductors 功能描述:PHAIP4365CX11/P,135 NPN SWITCHING TRANSI 制造商:NXP Semiconductors 功能描述:IC ESD INTERFACE PROTECT WAFER
IP4366CX8 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Integrated SIM card passive filter array with ESD protection to IEC 61000-4-2 level 4
IP4366CX8/P 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Integrated SIM card passive filter array with ESD protection to IEC 61000-4-2 level 4
IP4366CX8/P,135 功能描述:ESD 抑制器 INTEGRATED SIM CARD ESD PROTECTION IEC RoHS:否 制造商:STMicroelectronics 通道:8 Channels 擊穿電壓:8 V 電容:45 pF 端接類型:SMD/SMT 封裝 / 箱體:uQFN-16 功率耗散 Pd: 工作溫度范圍:- 40 C to + 85 C
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