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參數(shù)資料
| 型號(hào)： | IR21571 |
| 廠商： | International Rectifier |
| 英文描述： | FULLY INTEGRATED BALLAST CONTROL IC |
| 中文描述： | 完全集成的鎮(zhèn)流器控制IC |
| 文件頁(yè)數(shù)： | 8/17頁(yè) |
| 文件大?。?/td> | 234K |
| 代理商： | IR21571 |
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IR21571
(S)
8
www.irf.com
Supply Bypassing and PC Board
Layout Rules
Component selection and placement on the pc
board is extremely important when using power
control ICs. V
CC
should be bypassed to COM as close
to the IC terminals as possible with a low ESR/ESL
capacitor, as shown in Figure 1 below.
A rule of thumb for the value of this bypass capacitor
is to keep its minimum value at least 2500 times the
value of the total input capacitance (Ciss) of the
power transistors being driven. This decoupling
capacitor can be split between a higher valued
electrolytic type and a lower valued ceramic type
connected in parallel, although a good quality
electrolytic (e.g., 10
μ
F) placed immediately adjacent
to the V
CC
and COM terminals will work well.
In a typical application circuit, the supply voltage to
the IC is normally derived by means of a high value
startup resistor (1/4W) from the rectified line voltage,
in combination with a charge pump from the output
of the half-bridge. With this type of supply
arrangement, the internal 15.6V zener clamp diode
from V
CC
to COM will determine the steady state IC
supply voltage.
Connecting the IC Ground (COM)
to the Power Ground
Both the low power control circuitry and low side
gate driver output stage grounds return to this lead
within the IC. The COM lead should be connected to
the bottom terminal of the current sense resistor in
the source of the low side power MOSFET using an
individual pc board trace, as shown in Figure 2. In
addition, the ground return path of the timing
components and V
CC
decoupling capacitor should
be connected directly to the IC COM lead, and not
via separate traces or jumpers to other ground traces
on the board.
This connection technique prevents high current
ground loops from interfering with the sensitive timing
component operation, and allows the entire control
circuit to reject common-mode noise due to output
switching.
Description of Operation & Component Selection Tips
Figure 1: Supply bypassing PCB layout example
Figure 2: COM lead connection PCB layout example
C
VCC
(surface mount)
D
Boot
(surface mount)
C
BOOT
(surface mount)
C
VCC
(through hole)
pin 1
IR21571
C
VCC
(surface mount)
C
VCC
(through hole)
IR21571
pin 1
timing
components
V
BUS
return
R
CS
(through hole)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| IR21571PBF | 功能描述:功率驅(qū)動(dòng)器IC Ballast Cntrl Thrml Ovrload Prot RoHS:否 制造商:Micrel 產(chǎn)品:MOSFET Gate Drivers 類型:Low Cost High or Low Side MOSFET Driver 上升時(shí)間: 下降時(shí)間: 電源電壓-最大:30 V 電源電壓-最小:2.75 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| IR21571PBF | 制造商:International Rectifier 功能描述:Controller IC Output Voltage Max.:25V |
| IR21571S | 功能描述:IC BALLAST CONTROL 16-SOIC RoHS:否 類別:集成電路 (IC) >> PMIC - 照明，鎮(zhèn)流器控制器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:- 類型:CCFL 控制器 頻率:40 ~ 80 kHz 電流 - 電源:5mA 電流 - 輸出:- 電源電壓:4.5 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:帶卷 (TR) 其它名稱:90-3991V+V01 |
| IR21571SPBF | 功能描述:功率驅(qū)動(dòng)器IC BALLAST CTRL BELO 600V 15.6V VCC 150uA RoHS:否 制造商:Micrel 產(chǎn)品:MOSFET Gate Drivers 類型:Low Cost High or Low Side MOSFET Driver 上升時(shí)間: 下降時(shí)間: 電源電壓-最大:30 V 電源電壓-最小:2.75 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| IR21571STR | 功能描述:IC BALLAST CONTROL INTEG 16-SOIC RoHS:否 類別:集成電路 (IC) >> PMIC - 照明，鎮(zhèn)流器控制器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:- 類型:CCFL 控制器 頻率:40 ~ 80 kHz 電流 - 電源:5mA 電流 - 輸出:- 電源電壓:4.5 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:帶卷 (TR) 其它名稱:90-3991V+V01 |
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