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參數(shù)資料
| 型號(hào)： | IR2167S |
| 廠商： | International Rectifier |
| 元件分類： | 基準(zhǔn)電壓源/電流源 |
| 英文描述： | PFC Ballast Control. Thermal Overload Protection. Brown Out Protection. Programmable Preheat and Frequency. Programmable Deadtime in a 20 Lead SOIC package |
| 中文描述： | PFC的鎮(zhèn)流器控制。熱過載保護(hù)。欠壓保護(hù)。可編程預(yù)熱和頻率?？删幊趟绤^(qū)時(shí)間在20引腳SOIC封裝 |
| 文件頁數(shù)： | 28/30頁 |
| 文件大?。?/td> | 937K |
| 代理商： | IR2167S |
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IR2167(
S
)
28
www.irf.com
Component Selection Tips
Supply Bypassing and pc Board Layout Rules
Component selection and placement on the pc board is ex-
tremely important when using power control ICs. VCC should
be bypassed to COM as close to the IC terminals as pos-
sible with a low ESR/ESL capacitor, as shown in Figure 25.
Figure 25:
Supply bypassing PCB layout example
A rule of thumb for the value of this bypass capacitor is to
keep its minimum value at least 2500 times the value of the
total input capacitance (Ciss) of the power transistors being
driven. This decoupling capacitor can be split between a
higher valued electrolytic type and a lower valued ceramic
type connected in parallel, although a good quality electro-
lytic (e.g., 10
μ
F) placed immediately adjacent to the VCC
and COM terminals will work well.
In a typical application circuit, the supply voltage to the IC is
normally derived by means of a high value startup resistor
(1/4W) from the rectified line voltage, in combination with a
charge pump from the output of the half-bridge. With this
type of supply arrangement, the internal 15.6V zener clamp
diode from VCC to COM will determine the steady state IC
supply voltage.
C
VCC
(surface
mount)
C
BOOT
D
Boot
(surface
mount)
(surface
mount)
C
VCC
(through hole)
pin 1
IR2167
Connecting the IC Ground (COM) to the Power
Ground
Both the low power control circuitry and low side gate driver
output stage grounds return to this lead within the IC. The
COM lead should be connected to the bottom terminal of the
current sense resistor in the source of the low side power
MOSFET using an individual pc board trace, as shown in
Figure 26. In addition, the ground return path of the timing
components and VCC decoupling capacitor should be con-
nected directly to the IC COM lead, and not via separate
traces or jumpers to other ground traces on the board.
Figure 26:
COM lead connection PCB layout example
These connection techniques prevent high current ground
loops from interfering with sensitive timing component op-
eration, and allows the entire control circuit to reject com-
mon-mode noise due to output switching.
C
VCC
(surface
mount)
C
VCC
(through hole)
IR2167
pin 1
cotiming
s
V
BUS
return
R
CS
(through hole)
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| IR2170S | 功能描述:IC CURRENT SENSE 600V 1MA 8-SOIC RoHS:否 類別:集成電路 (IC) >> PMIC - 穩(wěn)流/電流管理 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:50 系列:- 功能:電流開關(guān) 檢測(cè)方法:- 精確度:±10% 輸入電壓:1.7 V ~ 5.5 V 電流 - 輸出:600mA 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:10-UFQFN 供應(yīng)商設(shè)備封裝:10-UTQFN（1.4x1.8） 包裝:管件 |
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