參數(shù)資料
型號: IR3624MPBF
廠商: International Rectifier
英文描述: HIGH FREQUENCY SYNCHRONOUS PWM BUCK CONTROLLER
中文描述: 高頻同步PWM降壓控制器
文件頁數(shù): 17/21頁
文件大?。?/td> 803K
代理商: IR3624MPBF
IR3624MPBF
Layout Consideration
The layout is very important when designing high
frequency switching converters. Layout will affect
noise pickup and can cause a good design to
perform with less than expected results.
Start to place the power components, make all
the connection in the top layer with wide, copper
filled areas.
Programming the Current-Limit
The Current-Limit threshold can be set by
connecting a resistor (R
SET
) from drain of low
side MOSFET to the OCSet pin. The resistor
can be calculated by using equation (3).
The
R
DS(on)
has
a
coefficient and it should be considered for the
worse case operation. This resistor must be
placed close to the IC, place a small ceramic
capacitor from this pin to ground for noise
rejection purposes.
positive
temperature
K
A
9
R
R
current)
output
nominal
=
over
=
(50%
9
5
.
1
6
I
I
m
1
.
20
5
.
1
m
4
=
13
R
7
OCSet
LIM
o
SET
on
DS
=
=
=
.
)
(
)
(
17
)
3
--(
R
I
R
I
I
on
DS
OCSet
OCSet
critical
L
SET
)
(
)
(
=
=
The inductor, output capacitor and the MOSFET
should be close to each other as possible. This
helps to reduce the EMI radiated by the power
traces due to the high switching currents through
them. Place input capacitor directly to the drain of
the high-side MOSFET, to reduce the ESR
replace the single input capacitor with two
parallel units.
The feedback part of the system should be kept
away from the inductor and other noise sources.
The critical bypass components such as
capacitors for Vcc and Vc should be close to
respective pins. It is important to place the
feedback components include feedback resistors
and compensation components close to Fb and
Comp pins.
In multilayer PCB use one layer as power ground
plane and have a control circuit ground (analog
ground), to which all signals are referenced. The
goal is to localize the high current path to a
separate loop that does not interfere with the
more sensitive analog control function. These two
grounds must be connected together on the PC
board layout at a single point.
The MLPD is thermal enhanced package, based
on thermal performance it is recommended to
use 4-layers PCB. To effectively remove heat
from the device the exposed pad should be
connected to ground plane using vias.
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