參數(shù)資料
型號(hào): IRCZ34
廠商: International Rectifier
英文描述: CAC 10C 10#16 SKT RECP BOX
中文描述: 功率MOSFET(減振鋼板基本\u003d 60V的,的Rds(on)\u003d 0.050ohm,身份證\u003d 30A條)
文件頁(yè)數(shù): 1/6頁(yè)
文件大?。?/td> 130K
代理商: IRCZ34
C-7
IRCZ34
PD - 9.590A
l
Dynamic dv/dt Rating
l
Current Sense
l
175°C Operating Temperature
l
Fast Switching
l
Ease of Paralleling
l
Simple Drive Requirements
HEXFET
Power MOSFET
V
DSS
= 60V
R
DS(on)
= 0.050
I
D
= 30A
Description
Third Generation HEXFETs from International Rectifier provide the designer with
the best combination of fast switching, ruggedized device, low on-resistance and
cost-effectiveness.
The HEXSence device provides an accurate fraction of the drain current through
the additional two leads to be used for control or protection of the device. These
devices exhibit similar electrical and thermal characteristics as their IRF-series
equivalent part numbers. The provision of a kelvin source connection effectively
eliminates problems of common source inductance when the HEXSence is
used as a fast, high-current switch in non current-sensing applications.
Absolute Maximum Ratings
Parameter
Max.
30
21
120
88
0.59
±20
15
4.5
Units
I
D
@ T
C
= 25°C
I
D
@ T
C
= 100°C
I
DM
P
D
@T
C
= 25°C
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting Torque, 6-32 or screw
W
W/°C
V
mJ
A
V
GS
E
AS
dv/dt
T
J
T
STG
-55 to + 175
300 (1.6mm from case)
10 lbfin (1.1 Nm)
A
°C
Parameter
Min.
Max.
0.50
Units
1.7
62
R
θ
JC
R
θ
CS
R
θ
JA
Junction-to-Case
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient
Thermal Resistance
** When mounted on FR-4 board using minimum recommended footprint. For recommended footprint and soldering techniques refer to application note #AN-994.
°C/W
TO-220 HexSense
相關(guān)PDF資料
PDF描述
IRCZ44 CAC 10C 10#16 SKT RECP BOX
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