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參數(shù)資料
| 型號： | IS-2981RH |
| 廠商： | Intersil Corporation |
| 英文描述： | Radiation Hardened 8-Channel Source Driver(抗輻射8通道源極驅(qū)動器) |
| 中文描述： | 輻射加固8通道源驅(qū)動器（抗輻射8通道源極驅(qū)動器） |
| 文件頁數(shù)： | 2/2頁 |
| 文件大?。?/td> | 39K |
| 代理商： | IS-2981RH |
2
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
www.intersil.com
Die Characteristics
DIE DIMENSIONS:
2667
μ
m x 5131
μ
m (105 mils x 202 mils)
Thickness: 483
μ
m
±
25.4
μ
m (19 mils
±
1 mil)
INTERFACE MATERIALS
Glassivation
Type: Nitride (Si
3
N
4
) over Silox (SiO
2
)
Nitride Thickness: 4.0k
±
1.0k
Silox Thickness: 12.0k
±
4.0k
Metallization
Top Metal 2: Ti/AlCu
Thickness: 1.6
μ
m
±
0.02
μ
m
Metal 1: Ti/AlCu
Thickness: 0.8
μ
m
±
0.01
μ
m
Substrate
HVTDLM, Bonded Wafer, Dielectric Isolation
Backside Finish
Silicon
ASSEMBLY RELATED INFORMATION
Substrate Potential
Must be tied to GND.
ADDITIONAL INFORMATION
Worst Case Current Density
<1.0 x 10
5
A/cm
2
Transistor Count
68
Metallization Mask Layout
IS-2981RH
8
7
6
5
4
3
2
1
9
9
10
11
12
13
14
15
16
17
18
10
10A
9
9
NOTES:
1. Pad numbers correspond to package pin functions.
2. Bond to all four pad 9 locations for V
CC
current sharing purposes.
3. Bond to both pad 10 locations for GND current sharing purposes.
4. Pad 10A is not used in die applications.
5. Die backside must be connected to GND.
IS-2981RH
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| IS-2981RH_13 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened 8-Channel Source Driver |
| IS29D | 制造商:IDEC Corporation 功能描述:Inductive sensor 6.5mm PNP M8 |
| IS29DK1 | 制造商:IDEC Corporation 功能描述: 制造商:IDEC Corporation 功能描述:SENS.IND. 10-30VDC PNP NO |
| IS29K1 | 制造商:IDEC CORPORATION 功能描述:SENS.IND. 10-30VDC PNP NO |
| IS29K1S | 制造商:IDEC CORPORATION 功能描述:SENS.IND. 10-30VDC PNP NO |
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