參數(shù)資料
型號(hào): IS61LPD102418A-250B3I
廠(chǎng)商: INTEGRATED SILICON SOLUTION INC
元件分類(lèi): DRAM
英文描述: 512K x 36, 1024K x 18 18Mb SYNCHRONOUS PIPELINED, DOUBLE CYCLE DESELECT STATIC RAM
中文描述: 1M X 18 CACHE SRAM, 2.6 ns, PBGA165
封裝: 13 X 15 MM, 1 MM PITCH, PLASTIC, BGA-165
文件頁(yè)數(shù): 22/29頁(yè)
文件大?。?/td> 219K
代理商: IS61LPD102418A-250B3I
22
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
02/03/06
IS61VPD51236A, IS61VPD102418A, IS61LPD51236A ,IS61LPD102418A
ISSI
TAP Electrical Characteristics
Over the Operating Range
(1,2)
Symbol
Parameter
Test Conditions
Min.
Max.
Units
V
OH1
Output HIGH Voltage
I
OH
= –2.0 mA
1.7
V
V
OH2
Output HIGH Voltage
I
OH
= –100 μA
2.1
V
V
OL1
Output LOW Voltage
I
OL
= 2.0 mA
0.7
V
V
OL2
Output LOW Voltage
I
OL
= 100 μA
0.2
V
V
IH
Input HIGH Voltage
1.7
V
DD
+0.3
V
V
IL
Input LOW Voltage
–0.3
0.7
V
I
X
Input Load Current
Vss
V I
V
DDQ
–5
5
mA
Notes:
1. All Voltage referenced to Ground.
2. Overshoot: V
IH
(AC)
V
DD
+1.5V for t
t
TCYC
/2,
Undershoot:V
IL
(AC)
0.5V for t
t
TCYC
/2,
Power-up: V
IH
< 2.6V and V
DD
< 2.4V and V
DDQ
< 1.4V for t < 200 ms.
TAP AC ELECTRICAL CHARACTERISTICS
(1,2)
(OVER OPERATING RANGE)
Symbol
Parameter
Min.
Max.
Unit
t
TCYC
TCK Clock cycle time
100
ns
f
TF
TCK Clock frequency
10
MHz
t
TH
TCK Clock HIGH
40
ns
t
TL
TCK Clock LOW
40
ns
t
TMSS
TMS setup to TCK Clock Rise
10
ns
t
TDIS
TDI setup to TCK Clock Rise
10
ns
t
CS
Capture setup to TCK Rise
10
ns
t
TMSH
TMS hold after TCK Clock Rise
10
ns
t
TDIH
TDI Hold after Clock Rise
10
ns
t
CH
Capture hold after Clock Rise
10
ns
t
TDOV
TCK LOW to TDO valid
20
ns
t
TDOX
TCK LOW to TDO invalid
0
ns
Notes:
1. Both t
CS
and t
CH
refer to the set-up and hold time latching data requirements from the boundary scan register.
2. Test conditions are specified using the load in TAP AC test conditions. t
R
/t
F
= 1 ns.
相關(guān)PDF資料
PDF描述
IS61LPD102418A-250TQ 512K x 36, 1024K x 18 18Mb SYNCHRONOUS PIPELINED, DOUBLE CYCLE DESELECT STATIC RAM
IS61LPD102418A-250TQI 512K x 36, 1024K x 18 18Mb SYNCHRONOUS PIPELINED, DOUBLE CYCLE DESELECT STATIC RAM
IS61LPD25636A-250B2I 256K x 36, 512K x 18 9 Mb SYNCHRONOUS PIPELINED, DOUBLE CYCLE DESELECT STATIC RAM
IS61LPD25636A-250B3 256K x 36, 512K x 18 9 Mb SYNCHRONOUS PIPELINED, DOUBLE CYCLE DESELECT STATIC RAM
IS61LPD25636A-250B3I 256K x 36, 512K x 18 9 Mb SYNCHRONOUS PIPELINED, DOUBLE CYCLE DESELECT STATIC RAM
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IS61LPD102418A-250B3I-TR 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 18Mb,Pipeline,Sync,1Mb x 18,250MHz,3.3V or 2.5V I/O,165 Ball BGA RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪(fǎng)問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
IS61LPD102418A-250B3-TR 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 18Mb,Pipeline,Sync,1Mb x 18,250MHz,3.3V or 2.5V I/O,165 Ball BGA RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪(fǎng)問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
IS61LPD102418A-250TQ 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 18Mb,Pipeline,Sync,1Mb x 18,250MHz,3.3V or 2.5V I/O,100 Pin TQFP RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪(fǎng)問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
IS61LPD102418A-250TQI 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 18Mb,Pipeline,Sync,1Mb x 18,250MHz,3.3V or 2.5V I/O,100 Pin TQFP RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪(fǎng)問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
IS61LPD102418A-250TQI-TR 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 18Mb,Pipeline,Sync,1Mb x 18,250MHz,3.3V or 2.5V I/O,100 Pin TQFP RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪(fǎng)問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray