Publication Release Date: Nov 6, 2008 - 16 - Revision 1.31 10 9 TYPICAL APPLICATION CIRCUITS The follo" />
參數(shù)資料
型號(hào)： ISD17210SY
廠商： Nuvoton Technology Corporation of America
文件頁(yè)數(shù)： 8/24頁(yè)
文件大?。?/td> 0K
描述： IC VOICE REC/PLAY 210SEC 28-SOIC
標(biāo)準(zhǔn)包裝： 25
系列： ISD1700, ChipCorder®
接口： SPI
持續(xù)時(shí)間： 210 秒
安裝類型： 表面貼裝
封裝/外殼： 28-SOIC（0.295"，7.50mm 寬）
供應(yīng)商設(shè)備封裝： 28-SOIC
配用： ISD-COB1790-ND - BOARD DEMO FOR ISD1790
ISD-COB1760-ND - BOARD DEMO FOR ISD1760
ISD-COB1750-ND - BOARD DEMO FOR ISD1750
ISD-COB1740-ND - BOARD DEMO FOR ISD1740
ISD-COB1730-ND - BOARD DEMO FOR ISD1730
ISD-COB17240-ND - BOARD DEMO FOR ISD17240
ISD-COB17210-ND - BOARD DEMO FOR ISD17210
ISD-COB17150-ND - BOARD DEMO FOR ISD17150
ISD-ES17XX_USB_PB-ND - BOARD DEMO FOR ISD1700 SERIES
PRELIMINARY ISD1700 SERIES
Publication Release Date: Nov 6, 2008
- 16 -
Revision 1.31
10
9
TYPICAL APPLICATION CIRCUITS
The following typical applications examples on ISD1700 Series are for references only. They make no
representation or warranty that such applications shall be suitable for the use specified. Each design
has to be optimized in its own system for the best performance on voice quality, current consumption,
functionalities and etc.
The below notes apply to the following applications examples:
*
These capacitors may be needed in order to optimize for the best voice quality, which is also dependent
upon the layout of the PCB. Depending on system requirements, they can be 10
μF, 4.7 μF or other values.
Please refer to the applications notes or consult Nuvoton for layout advice.
** It is important to have a separate path for each ground and power back to the related terminals to minimize
the noise. Also, the power supplies should be decoupled as close to the device as possible
.
Example #1: Recording using microphone input via push-button controls
Vcc
ISD1700
R
OSC
V
CCA
SP+
AUD/AUX
ERASE
PLAY
REC
AGC
V
SSD
V
CCD
AnaIn
MIC -
MIC+
MISO
MOSI
SCLK
SS
FWD
VOL
V
CCA
0.1 F
μ
V
CCD
*
24
23
25
26
19
10
11
20
18
1
28
17
22
9
V
CCA
V
CCD
V
CCP
V
SSA
V
CCP
V
SSP1
SP-
V
SSP2
V
CCP
0.1 F
μ
0.1 F
μ
*
21
8
14
16
12
0.1 F
μ
*
INT/RDY
27
7
6
5
4
V
CC
4.7 F
μ
Ω
4.7 K
0.1 F
μ
4.7 K
Ω
0.1 F
μ
4.7 K
Ω
**
*** At 8kHz sampling freq, Rosc = 80 K
Rosc ***
4.7 F
μ
FT
15
13
Speaker
or Buzzer
V
CCD
Optional
Ω
100 K
Optional: based upon the applications
390
Ω
0.1 F
μ
V
CC
8050C
Speaker
AUX
AUD
Gnd
LED
1 K
Ω
D1
2
vAlert
3
RESET
0.1 F
μ
Reset
: Digital ground;
: Analog ground;
: Ground for SP+;
: Ground for SP-
相關(guān)PDF資料
PDF描述
ISD17210PY IC VOICE REC/PLAY 210SEC 28-DIP
VE-21V-CV-S CONVERTER MOD DC/DC 5.8V 150W
VE-21R-CV-S CONVERTER MOD DC/DC 7.5V 150W
JBXPC1G05FCSDSR CONN RCPT 5POS CABLE MNT CRIMP
VI-2NM-CV-S CONVERTER MOD DC/DC 10V 150W
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISD17210SY01 功能描述:IC VOICE REC/PLAY 210SEC 28-SOIC RoHS:是 類別:集成電路 (IC) >> 接口 - 語(yǔ)音錄制和重放 系列:ISD1700, ChipCorder® 標(biāo)準(zhǔn)包裝:14 系列:- 接口:串行 濾波器通頻帶:1.7kHz 持續(xù)時(shí)間:8 ~ 32 秒 安裝類型:通孔 封裝/外殼:28-DIP（0.300"，7.62mm） 供應(yīng)商設(shè)備封裝:28-PDIP 其它名稱:90-21300+000
ISD17210SYI 功能描述:IC VOICE REC/PLAY 210SEC 28-SOIC RoHS:是 類別:集成電路 (IC) >> 接口 - 語(yǔ)音錄制和重放 系列:ISD1700, ChipCorder® 標(biāo)準(zhǔn)包裝:14 系列:- 接口:串行 濾波器通頻帶:1.7kHz 持續(xù)時(shí)間:8 ~ 32 秒 安裝類型:通孔 封裝/外殼:28-DIP（0.300"，7.62mm） 供應(yīng)商設(shè)備封裝:28-PDIP 其它名稱:90-21300+000
ISD17210SYI01 功能描述:IC VOICE REC/PLAY 210SEC 28-SOIC RoHS:是 類別:集成電路 (IC) >> 接口 - 語(yǔ)音錄制和重放 系列:ISD1700, ChipCorder® 標(biāo)準(zhǔn)包裝:14 系列:- 接口:串行 濾波器通頻帶:1.7kHz 持續(xù)時(shí)間:8 ~ 32 秒 安裝類型:通孔 封裝/外殼:28-DIP（0.300"，7.62mm） 供應(yīng)商設(shè)備封裝:28-PDIP 其它名稱:90-21300+000
ISD17210SYIR 功能描述:IC VOICE REC/PLAY 210SEC 28-SOIC RoHS:是 類別:集成電路 (IC) >> 接口 - 語(yǔ)音錄制和重放 系列:ISD1700, ChipCorder® 標(biāo)準(zhǔn)包裝:14 系列:- 接口:串行 濾波器通頻帶:1.7kHz 持續(xù)時(shí)間:8 ~ 32 秒 安裝類型:通孔 封裝/外殼:28-DIP（0.300"，7.62mm） 供應(yīng)商設(shè)備封裝:28-PDIP 其它名稱:90-21300+000
ISD17210SYIR01 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
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