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參數(shù)資料
| 型號： | ISD1740SYR |
| 廠商： | Nuvoton Technology Corporation of America |
| 文件頁數(shù)： | 10/24頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC VOICE REC/PLAY 40SEC 28-SOIC |
| 標(biāo)準(zhǔn)包裝： | 1,000 |
| 系列： | ISD1700, ChipCorder® |
| 接口： | SPI |
| 持續(xù)時間： | 40 秒 |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 28-SOIC（0.295"，7.50mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 28-SOIC |
| 配用： | ISD-COB1790-ND - BOARD DEMO FOR ISD1790 ISD-COB1760-ND - BOARD DEMO FOR ISD1760 ISD-COB1750-ND - BOARD DEMO FOR ISD1750 ISD-COB1740-ND - BOARD DEMO FOR ISD1740 ISD-COB1730-ND - BOARD DEMO FOR ISD1730 ISD-COB17240-ND - BOARD DEMO FOR ISD17240 ISD-COB17210-ND - BOARD DEMO FOR ISD17210 ISD-COB17150-ND - BOARD DEMO FOR ISD17150 ISD-ES17XX_USB_PB-ND - BOARD DEMO FOR ISD1700 SERIES |
PRELIMINARY ISD1700 SERIES
Publication Release Date: Nov 6, 2008
- 18 -
Revision 1.31
Example #3: Connecting the SPI Interface to a microcontroller
ISD1700
R
OSC
ERASE
PLAY
REC
AGC
AnaIn
MIC -
MIC+
MISO
MOSI
SCLK
SS
FWD
VOL
24
23
25
26
19
10
11
20
18
22
9
7
6
5
4
*** At 8kHz sampling freq, Rosc = 80 K
Rosc ***
4.7 F
μ
FT
0.1 F
μ
To uC
SPI
: Digital ground;
: Analog ground;
: Ground for SP+;
: Ground for SP-
Vcc
Gnd
V
CCA
SP+
AUD/AUX
V
SSD
V
CCD
V
CCA
0.1 F
μ
LED
1 K
Ω
V
CCD
*
D1
2
1
28
17
V
CCA
V
CCD
V
CCP
V
SSA
V
CCP
V
SSP1
SP-
V
SSP2
V
CCP
0.1 F
μ
0.1 F
μ
*
21
8
14
16
12
0.1 F
μ
*
INT/RDY
27
**
15
13
Speaker
or Buzzer
V
CCD
Optional
Ω
100 K
vAlert
Optional: based upon the applications
390
Ω
0.1 F
μ
V
CC
8050C
Speaker
AUX
AUD
3
RESET
0.1 F
μ
Reset
10.1
20
GOOD AUDIO DESIGN PRACTICES
y decoupling. See recommendations from below links or other
pplication Notes in our websites.
AN-CC1002 Design Considerations for ISD1700 Family.pdf
G
http://www.Nuvoton-usa.com/products/isd_products/chipcorder/applicationinfo/apin11.pdf
To ensure the highest quality of voice reproduction, it is important to follow good audio design
practices in layout and power suppl
A
Design Considerations for ISD1700 Family
ood Audio Design Practices
S
http://www.Nuvoton-usa.com/products/isd_products/chipcorder/applicationinfo/apin12.pdf
ingle-Chip Board Layout Diagrams
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| VE-23Z-IV-F3 | CONVERTER MOD DC/DC 2V 60W |
| VE-23Z-IV-F2 | CONVERTER MOD DC/DC 2V 60W |
| ISD1740EYR | IC VOICE REC/PLAY 40SEC 28-TSOP |
| VE-21J-CV-S | CONVERTER MOD DC/DC 36V 150W |
| VI-2TM-CV-S | CONVERTER MOD DC/DC 10V 150W |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISD1740SYR01 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD1740XY | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD1740XY01 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD1740XYI | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD1740XYI01 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
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