I2C INTERFACE V
參數(shù)資料
型號: ISL22326WFR16Z-TK
廠商: Intersil
文件頁數(shù): 8/15頁
文件大?。?/td> 0K
描述: IC POT DGTL 128TP LN LP 16-QFN
標準包裝: 1,000
系列: XDCP™
接片: 128
電阻(歐姆): 10k
電路數(shù): 2
溫度系數(shù): 標準值 ±50 ppm/°C
存儲器類型: 非易失
接口: I²C(設(shè)備位址)
電源電壓: 2.7 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 16-VFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 16-QFN-EP(4x4)
包裝: 帶卷 (TR)
2
FN6176.2
September 8, 2009
Block Diagram
I2C
INTERFACE
VCC
RH0
RH1
GND
RL0
RL1
RW0
RW1
SCL
SDA
A0
A1
A2
WR1
WR0
SHDN
POWER-UP
INTERFACE,
CONTROL
AND STATUS
LOGIC
NON-
VOLATILE
REGISTERS
Pin Descriptions
TSSOP PIN
NUMBER
QFN PIN
NUMBER
PIN NAME
DESCRIPTION
115
VCC
Power supply pin
2
16
SHDN
Shutdown active low input
3
1
RH0
“High” terminal of DCP0
4
2
RL0
“Low” terminal of DCP0
5
3
RW0
“Wiper” terminal of DCP0
6
5
A2
Device address input for the I2C interface
7
6
SCL
Open drain I2C interface clock input
8
7
SDA
Open drain Serial data I/O for the I2C interface
9
8
GND
Device ground pin
10
RW1
“Wiper” terminal of DCP1
11
RL1
“Low” terminal of DCP1
12
RH1
“High” terminal of DCP1
13
A0
Device address input for the I2C interface
14
A1
Device address input for the I2C interface
4, 9
NC
No connection
EPAD*
Exposed Die Pad internally connected to GND
*Note: PCB thermal land for QFN EPAD should be connected to GND plane or left floating. For more information refer to
http://www.intersil.com/data/tb/TB389.pdf
ISL22326
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