參數(shù)資料
型號: ISL22349UFV14Z-TK
廠商: Intersil
文件頁數(shù): 7/13頁
文件大?。?/td> 0K
描述: IC POT DGTL 128TP LN LP 14-TSSOP
標準包裝: 1,000
系列: XDCP™
接片: 128
電阻(歐姆): 50k
電路數(shù): 4
溫度系數(shù): 標準值 ±80 ppm/°C
存儲器類型: 非易失
接口: I²C(設備位址)
電源電壓: 2.7 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 14-TSSOP(0.173",4.40mm 寬)
供應商設備封裝: 14-TSSOP
包裝: 帶卷 (TR)
3
FN6331.3
May 28, 2009
Absolute Maximum Ratings
Thermal Information
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Voltage at any Digital Interface Pin
with Respect to GND . . . . . . . . . . . . . . . . . . . . -0.3V to VCC + 0.3
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6V
Voltage at any DCP Pin with Respect to GND. . . . . . . -0.3V to VCC
IW (10s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±6mA
Latchup (Note 2) . . . . . . . . . . . . . . . . . . Class II, Level B @ +125°C
ESD Rating
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5kV
Charged Device Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1kV
Thermal Resistance (Typical, Note 1)
θ
JA (°C/W)
14 Ld TSSOP package . . . . . . . . . . . . . . . . . . . . . .
+100
Max Junction Temperature (Plastic Package) . .
+50°C to +150°C
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
Recommended Operating Conditions
Ambient Temperature . . . . . . . . . . . . . . . . . . . . . . . -40°C to +125°C
VCC Voltage for DCP Operation . . . . . . . . . . . . . . . . . . 2.7V to 5.5V
Wiper Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -3mA to 3mA
Power Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5mW
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1.
θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
2. Jedec Class II pulse conditions and failure criterion used. Level B exceptions are: using a max positive pulse of 6.5V on the SHDN pin, and using
a max negative pulse of -0.8V for all pins.
Analog Specifications
Over recommended operating conditions unless otherwise stated.
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
(Note 13)
TYP
(Note 3)
MAX
(Note 13)
UNIT
RTOTAL
End-to-End Resistance
W option
10
k
Ω
U option
50
k
Ω
End-to-End Resistance Tolerance
W and U option
-20
+20
%
End-to-End Temperature Coefficient
W option
±50
ppm/°C
(Note 11)
U option
±80
ppm/°C
(Note 11)
RW
(Note 13)
Wiper Resistance
VCC = 3.3V @ +25°C,
wiper current = VCC/RTOTAL
70
Ω
CW
(Note 11)
Wiper Capacitance
25
pF
VOLTAGE DIVIDER MODE (measured at RWi, unloaded; i = 0, 1, 2, or 3)
INL
(Note 8)
Integral Non-linearity
Monotonic over all tap positions
-1
1
LSB
(Note 4)
DNL
(Note 7)
Differential Non-linearity
Monotonic over all tap positions
-0.5
0.5
LSB
(Note 4)
ZSerror
(Note 5)
Zero-scale Error
W option
0
1
5
LSB
(Note 4)
U option
0
0.5
2
FSerror
(Note 6)
Full-scale Error
W option
-5
-1
0
LSB
(Note 4)
U option
-2
-1
0
VMATCH
(Note 9)
DCP to DCP Matching
Any two DCPs at the same tap position
-2
2
LSB
(Note 4)
TCV
(Note 10)
Ratiometric Temperature Coefficient
DCP register set to 40 hex
±4
ppm/°C
ISL22349
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