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參數(shù)資料
| 型號： | ISL22424WFR16Z |
| 廠商： | Intersil |
| 文件頁數(shù)： | 9/18頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC POT DGTL 256TP LN LP 16-QFN |
| 標準包裝： | 750 |
| 系列： | XDCP™ |
| 接片： | 256 |
| 電阻（歐姆）： | 10k |
| 電路數(shù)： | 2 |
| 溫度系數(shù)： | 標準值 ±85 ppm/°C |
| 存儲器類型： | 非易失 |
| 接口： | 4 線 SPI（芯片選擇） |
| 電源電壓： | 2.25 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-VFQFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 16-QFN-EP（4x4） |
| 包裝： | 管件 |
17
FN6425.0
May 31, 2007
ISL22424
Quad Flat No-Lead Plastic Package (QFN)
Micro Lead Frame Plastic Package (MLFP)
L16.4x4A
16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220-VGGD-10)
SYMBOL
MILLIMETERS
NOTES
MIN
NOMINAL
MAX
A
0.80
0.90
1.00
-
A1
-
0.05
-
A2
-
1.00
9
A3
0.20 REF
9
b
0.18
0.25
0.30
5, 8
D
4.00 BSC
-
D1
3.75 BSC
9
D2
2.30
2.40
2.55
7, 8
E
4.00 BSC
-
E1
3.75 BSC
9
E2
2.30
2.40
2.55
7, 8
e
0.50 BSC
-
k0.25
-
L
0.30
0.40
0.50
8
L1
-
0.15
10
N16
2
Nd
4
3
Ne
4
3
P-
-
0.60
9
θ
--
12
9
Rev. 2 3/06
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land
Pattern Design efforts, see Intersil Technical Brief TB389.
9. Features and dimensions A2, A3, D1, E1, P &
θ are present when
Anvil singulation method is used and not present for saw
singulation.
10. Depending on the method of lead termination at the edge of the
package, a maximum 0.15mm pull back (L1) maybe present.
L minus L1 to be equal to or greater than 0.3mm.
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