18 FN7872.0 June 21, 2011 Thin Shrink Small Outline Package Family (TSSOP) N (N/2)+1 (N/2) TOP VIEW A D 0.20 C 2X B A N/2 LEAD TIPS B " />
參數(shù)資料
型號(hào): ISL23345UFRZ-T7A
廠商: Intersil
文件頁(yè)數(shù): 10/19頁(yè)
文件大?。?/td> 0K
描述: IC DGTL POT 256POS 50K 20QFN
標(biāo)準(zhǔn)包裝: 1
系列: XDCP™
接片: 256
電阻(歐姆): 50k
電路數(shù): 4
溫度系數(shù): 標(biāo)準(zhǔn)值 65 ppm/°C
存儲(chǔ)器類(lèi)型: 易失
接口: I²C,2 線串口
電源電壓: 1.2 V ~ 5.5 V,1.7 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 20-VFQFN 裸露焊盤(pán)
供應(yīng)商設(shè)備封裝: 20-QFN(3x4)
包裝: 標(biāo)準(zhǔn)包裝
其它名稱: ISL23345UFRZ-T7ADKR
ISL23345
18
FN7872.0
June 21, 2011
Thin Shrink Small Outline Package Family (TSSOP)
N
(N/2)+1
(N/2)
TOP VIEW
A
D
0.20 C
2X
B A
N/2 LEAD TIPS
B
E1
E
0.25
CAB
M
1
H
PIN #1 I.D.
0.05
e
C
0.10 C
N LEADS
SIDE VIEW
0.10
CAB
M
b
c
SEE DETAIL “X”
END VIEW
DETAIL X
A2
0° - 8°
GAUGE
PLANE
0.25
L
A1
A
L1
SEATING
PLANE
MDP0044
THIN SHRINK SMALL OUTLINE PACKAGE FAMILY
SYMBOL
MILLIMETERS
TOLERANCE
14 LD 16 LD 20 LD 24 LD 28 LD
A
1.20
Max
A1
0.10
±0.05
A2
0.90
±0.05
b
0.25
+0.05/-0.06
c
0.15
+0.05/-0.06
D
5.00
6.50
7.80
9.70
±0.10
E
6.40
Basic
E1
4.40
±0.10
e
0.65
Basic
L
0.60
±0.15
L1
1.00
Reference
Rev. F 2/07
NOTES:
1. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per side.
2. Dimension “E1” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm per
side.
3. Dimensions “D” and “E1” are measured at dAtum Plane H.
4. Dimensioning and tolerancing per ASME Y14.5M
-1994.
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