22 FN7549.2 February 26, 2014 Package Outline Drawing M16.173 16 LEAD THIN" />
參數(shù)資料
型號: ISL26314FVZ-T7A
廠商: Intersil
文件頁數(shù): 15/23頁
文件大?。?/td> 0K
描述: IC ADC 12BIT SRL/SPI 16TSSOP
標準包裝: 1
位數(shù): 12
采樣率(每秒): 125k
數(shù)據(jù)接口: 串行,SPI?
轉(zhuǎn)換器數(shù)目: 1
功率耗散(最大): 80mW
電壓電源: 單電源
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 16-TSSOP(0.173",4.40mm 寬)
供應商設備封裝: 16-TSSOP
包裝: 標準包裝
輸入數(shù)目和類型: 4 個差分,單極
其它名稱: ISL26314FVZ-T7ADKR
ISL26310, ISL26311, ISL26312, ISL26313, ISL26314, ISL26315, ISL26319
22
FN7549.2
February 26, 2014
Package Outline Drawing
M16.173
16 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 2, 5/10
0.09-0.20
SEE DETAIL "X"
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
TOP VIEW
SIDE VIEW
END VIEW
Dimension does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
Dimensions are measured at datum plane H.
Dimensioning and tolerancing per ASME Y14.5M-1994.
Dimension does not include dambar protrusion. Allowable protrusion
shall be 0.08mm total in excess of dimension at maximum material
condition. Minimum space between protrusion and adjacent lead
is 0.07mm.
Dimension in ( ) are for reference only.
Conforms to JEDEC MO-153.
6.
3.
5.
4.
2.
1.
NOTES:
7.
(0.65 TYP)
(5.65)
(0.35 TYP)
0.90 +0.15/-0.10
0.60 ±0.15
0.15 MAX
0.05 MIN
PLANE
GAUGE
0°-8°
0.25
1.00 REF
(1.45)
16
2
1
3
8
B
1
3
9
A
PIN #1
I.D. MARK
5.00 ±0.10
6.40
4.40 ±0.10
0.65
1.20 MAX
SEATING
PLANE
0.25 +0.05/-0.06 5
C
H
0.20 C B A
0.10 C
-
0.05
0.10
C B A
M
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