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參數(shù)資料
| 型號： | ISL3036EIRZ-TK |
| 廠商： | Intersil |
| 文件頁數(shù)： | 8/16頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC LEVEL TRANSLATOR 4CH 14-TQFN |
| 標(biāo)準(zhǔn)包裝： | 1,000 |
| 邏輯功能： | 變換器，雙向 |
| 位數(shù)： | 4 |
| 輸入類型： | 邏輯 |
| 輸出類型： | 邏輯 |
| 數(shù)據(jù)速率： | 100Mbps |
| 通道數(shù)： | 4 |
| 輸出/通道數(shù)目： | 1 |
| 差分 - 輸入:輸出： | 無/無 |
| 電源電壓： | 2.2 V ~ 3.6 V |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 14-VFDFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 14-QFN |
| 包裝： | 帶卷 (TR) |
16
FN6492.0
March 31, 2009
Thin Quad Flat No-Lead Plastic Package (TQFN)
Thin Micro Lead Frame Plastic Package (TMLFP)
)
INDEX
D1/2
D1
D/2
D
E1/2
E/2
E
A
2X
0.15
B
C
0.10
B
A
MC
A
N
SEATING PLANE
N
6
3
2
3
e
1
0.08
FOR ODD TERMINAL/SIDE
FOR EVEN TERMINAL/SIDE
C
SECTION "C-C"
NX b
A1
C
2X
C
0.15
2X
B
0
REF.
(Nd-1)Xe
(Ne-1)Xe
REF.
5
A1
4X P
A
C
4X P
B
2X
A
C
0.15
A2
A3
D2
E2
E2/2
TERMINAL TIP
SIDE VIEW
TOP VIEW
7
BOTTOM VIEW
7
5
CL
e
E1
2
NX k
NX b
8
NX L
8
9
AREA
9
4X
0.10 C
/ /
9
(DATUM B)
(DATUM A)
AREA
INDEX
6
AREA
N
9
CORNER
OPTION 4X
L1
L
10
L1
L
10
L16.3x3A
16 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
SYMBOL
MILLIMETERS
NOTES
MIN
NOMINAL
MAX
A
0.70
0.75
0.80
-
A1
-
0.05
-
A2
-
0.80
9
A3
0.20 REF
9
b
0.18
0.23
0.30
5, 8
D
3.00 BSC
-
D1
2.75 BSC
9
D2
1.35
1.50
1.65
7, 8, 10
E
3.00 BSC
-
E1
2.75 BSC
9
E2
1.35
1.50
1.65
7, 8, 10
e
0.50 BSC
-
k0.20
-
L
0.30
0.40
0.50
8
N16
2
Nd
4
3
Ne
4
3
P-
-
0.60
9
θ
--
12
9
Rev. 0 6/04
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land
Pattern Design efforts, see Intersil Technical Brief TB389.
9. Features and dimensions A2, A3, D1, E1, P &
θ are present when
Anvil singulation method is used and not present for saw
singulation.
10. Compliant to JEDEC MO-220WEED-2 Issue C, except for the E2
and D2 MAX dimension.
ISL3034E, ISL3035E, ISL3036E
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