3 FN6974.2 July 19, 2012 Absolute Maximum Ratings Thermal Information Supply Voltage (VDD
參數(shù)資料
型號: ISL36111DRZ-T7
廠商: Intersil
文件頁數(shù): 3/9頁
文件大?。?/td> 0K
描述: IC EQUALIZER REC 11.1GBPS 16QFN
標(biāo)準(zhǔn)包裝: 1
系列: QLx™
應(yīng)用: 數(shù)據(jù)傳輸
電源電壓: 1.1 V ~ 1.3 V
封裝/外殼: 16-VFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 16-QFN-EP(3x3)
包裝: 標(biāo)準(zhǔn)包裝
安裝類型: 表面貼裝
產(chǎn)品目錄頁面: 1235 (CN2011-ZH PDF)
其它名稱: ISL36111DRZ-T7DKR
QLX111RIQT7-DKR
QLX111RIQT7-DKR-ND
ISL36111
3
FN6974.2
July 19, 2012
Absolute Maximum Ratings
Thermal Information
Supply Voltage (VDD to GND). . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 1.5V
Voltage at All Input Pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 1.5V
ESD Rating
High-Speed Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5kV (HBM)
All Other Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2kV (HBM)
Thermal Resistance (Typical)
θJA (°C/W)
θJC (°C/W)
16 Ld QFN Package (Notes 4, 5) . . . . . . . .
56
10
Operating Ambient Temperature Range . . . . . . . . . . . . . . . . 0°C to +85°C
Storage Ambient Temperature Range . . . . . . . . . . . . . . . .-55°C to +150°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . .+125°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTE:
4.
θJA measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief
5. For
θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Operating Conditions
PARAMETER
SYMBOL
CONDITION
MIN
TYP
MAX
UNITS
Supply Voltage
VDD
1.1
1.2
1.3
V
Operating Ambient Temperature
TA
025
85
°C
Bit Rate
NRZ data applied to any channel
1
11.1
Gb/s
Control Pin Characteristics VDD = 1.2V, TA = +25°C, and VIN = 600mVP-P, unless otherwise noted.
PARAMETER
SYMBOL
CONDITION
MIN
(Note 14) TYP
MAX
(Note 14) UNITS
Output LOW Logic Level
VOL
LOSB
0
250
mV
Output HIGH Logic Level
VOH
LOSB
1000
VDD
mV
Input Current
Current draw on boost control pin, i.e., CP[A,B]
30
100
A
Electrical Specifications VDD = 1.2V, TA = +25°C, and VIN = 600mVP-P, unless otherwise noted.
PARAMETERS
SYMBOL
CONDITION
MIN
(Note 14)
TYP
MAX
(Note 14) UNITS
NOTES
Supply Current
IDD
92
mA
Cable Input Amplitude Range
VIN
Measured differentially at data source before
encountering channel loss; Up to 10m 28AWG
standard twin-axial cable (approx. -27dB @ 5GHz)
600
1600
mVP-P
DC Differential Input Resistance
Measured on input channel IN[P,N]
80
100
120
Ω
DC Single-Ended Input Resistance
Measured on input channel IN[P] or IN[N], with
respect to VDD.
40
50
60
Ω
Input Return Loss Limit
(Differential)
SDD11
100MHz to 4.1GHz
Note 7
dB
4.1GHz to 11.1GHz
Note 8
dB
Output Amplitude Range
VOUT
Measured differentially at OUT[P] and OUT[N]
with 50
Ω load on both output pins
450
650
850
mVP-P
Differential Output Impedance
Measured on OUT[P,N]
80
105
120
Ω
Output Return Loss Limit
(Differential)
SDD22
100MHz to 4.1GHz
Note 7
dB
4.1GHz to 11.1GHz
Note 8
dB
Output Return Loss Limit (Common
Mode)
SCC22
100MHz to 2.5GHz
Note 9
dB
2.5GHz to 11.1GHz
-3
dB
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