4
FN6817.4
June 17, 2010
Absolute Maximum Ratings
Thermal Information
VDD to GND. . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 5.5V
Input Voltages
1D+, 1D-, L, R, 2D+, 2D-. . . . . . . . . . . . . . . -2V to 5.5V
C0, C1 (Note
6). . . . . . . . . . . . . . . . . . . . . -0.3V to 5.5V
Output Voltages
COM-, COM+ . . . . . . . . . . . . . . . . . . . . . . . -2V to 5.5V
Continuous Current (L, R) . . . . . . . . . . . . . . . . . . . ±60mA
Peak Current (L, R)
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . ±120mA
Continuous Current (1D-, 1D+, 2D-, 2D+) . . . . . . . ±40mA
Peak Current (1D-, 1D+, 2D-, 2D+)
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . ±100mA
ESD Rating:
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . >5kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . >500V
Charged Device Model . . . . . . . . . . . . . . . . . . . . . . >2kV
Latch-up Tested per JEDEC; Class II Level A . . . . . . at 85°C
Thermal Resistance (Typical)
θJA (°C/W) θJC (°C/W)
12 Ld TQFN Package (Note
7,
10).
155
90
12 Ld TQFN Package (Notes
8, 9). .
58
1.0
Maximum Junction Temperature (Plastic Package). . +150°C
Maximum Storage Temperature Range. . . . . -65°C to +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . .see link below
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . -40°C to +85°C
Supply Voltage Range . . . . . . . . . . . . . . . . . . 2.7V to 4.6V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact
product reliability and result in failures not covered by warranty.
NOTES:
6. Signals on C1 and C0 exceeding GND by specified amount are clamped. Limit current to maximum current ratings.
7. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief
TB379 for details.
8. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach”
features. See Tech Brief TB379.
9. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
10. For θJC, the “case temp” location is taken at the package top center.
Electrical Specifications - 2.7V to 3.6V Supply Test Conditions: VDD = +3.0V, GND = 0V, VC0H, VC1H = 1.4V, VC0L,
VC1L= 0.5V, (Note 11), Unless Otherwise Specified. Boldface limits apply over the operating temperature range,
-40°C to +85°C.
PARAMETER
TEST CONDITIONS
TEMP
(°C)
MIN
(Notes
MAX
(Notes
ANALOG SWITCH CHARACTERISTICS
Audio Switches (L, R)
Analog Signal Range, VANALOG
VDD = 3.0V to 3.6V, Audio Mode (C0 = VDD,
C1 = VDD)
Full
-1.5
-
1.5
V
ON-Resistance, rON
VDD = 3.0V, Audio Mode (C0 = 1.4V, C1 = 1.4V),
ICOMx =60mA, VL or VR = -0.85V to 0.85V, (see
+25
-
2.3
2.8
Ω
Full
-
3.4
Ω
rON Matching Between Channels,
ΔrON
VDD = 3.0V, Audio Mode (C0 = 1.4V, C1 = 1.4V),
ICOMx =60mA, VL or VR = Voltage at max rON over
signal range of -0.85V to 0.85V, (Notes
15,
16)+25
-
0.04
0.25
Ω
Full
-
0.26
Ω
rON Flatness, rFLAT(ON)
VDD = 3.0V, Audio Mode (C0 = 1.4V, C1 = 1.4V),
ICOMx =60mA, VL or VR = -0.85V to 0.85V,
+25
-
0.03
0.05
Ω
Full
-
0.07
Ω
Click/Pop Shunt Resistance, RL, RR VDD = 3.6V, ALL OFF Mode (C0 = 0.5V, C1 = 0.5V),
VCOM- or VCOM+ = -0.85V, 0.85V, VL or VR = -0.85V,
0.85V, Measure current into L or R pin and calculate
resistance value.
+25
-
28
-
Ω
USB/DATA Switches (1D+, 1D-, 2D+, 2D-)
Analog Signal Range, VANALOG
VDD = 2.7V to 4.6V, USB1 mode (C0 = 0V, C1 = VDD)
or USB2 Mode (C0 = VDD, C1 = 0V)
Full
-1
-
VDD
V
ISL54217