FN6819.1 February 4, 2010 Products Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. Th" />
參數(shù)資料
型號(hào): ISL54220IRUEVAL1Z
廠商: Intersil
文件頁數(shù): 7/18頁
文件大小: 0K
描述: EVALUATION BOARD FOR ISL54220
標(biāo)準(zhǔn)包裝: 1
主要目的: 接口,2:1 多路復(fù)用器
嵌入式:
已用 IC / 零件: ISL54220
主要屬性: 2 x SPDT 模擬開關(guān)
次要屬性: 2.7 V ~ 5.5 V 電源
已供物品:
15
FN6819.1
February 4, 2010
Products
Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The
Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones,
handheld products, and notebooks. Intersil's product families address power management and analog signal
processing functions. Go to www.intersil.com/products for a complete list of Intersil product families.
*For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device
information page on intersil.com: ISL54220
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to
web to make sure you have the latest Rev.
DATE
REVISION
CHANGE
2/4/10
FN6819.1
Updated to new Intersil data sheet format.
Page 1 Updated with Related Literature and Marketing graphics.
In Pin Configurations on page 2: 10 Ld MSOP and 10 Ld TDFN used to have same Pinout. Made
separate pinout for the 10 Ld TDFN
Updated Pin Description Table on page 2 to new format by adding pin number and package
type columns.
Added MSL note to Ordering information on page 3.
“Thermal Information” on page 4: Added Theta JC value of 105 and applicable Theta JC note
for the 10 Ld TQFN. Added Theta JC value of 65 and applicable Theta JC note for 10 Ld MSOP.
10 Ld TQFN Theta JA note changed from:
“θJA is measured with the component mounted on a high effective thermal conductivity test
board in free air. See Tech Brief TB379 for details.”
to:
θJA is measured in free air with the component mounted on a high effective thermal
conductivity test board with “direct attach” features. See Tech Brief TB379.”
Updated package outline drawings L10.1.8x1.4A and L10.3x3A to most recent revisions.
Changes to L10.1.8x1.4A were to add solder footprint. Changes to L10.3x3A were to change
tolerance in top view from 0.15 to 0.10. Changes to L10.1.8x1.4A were to add solder footprint.
Changes to L10.3x3A were to change tolerance in top view from 0.15 to 0.10.
On“” on page 1 in Features section changed On Capacitance from 7.4pF to 4.2pF at 240MHz.
Page 1 in Features section changed from:
Low ON-Resistance . . . . . . . . . . . . . . . . . . . . . . 6.7Ω
to:
Low ON-Resistance @ VDD = 5.5V . . . . . . . . . . . 4.5Ω
Low ON-Resistance @ VDD = 3.3V . . . . . . . . . . . 6.0Ω
Page 5 in Electrical Specification table added COM ON Capacitance, CDX(ON) at f = 240MHz
12/16/08
FN6819.0
Initial Release.
ISL54220
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