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5
FN6825.2
May 28, 2009
Absolute Maximum Ratings
Thermal Information
VDD to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6.5V
Input Voltages
NCx, NOx (Note
3) . . . . . . . . . . . . . . . . . . . . . . . . - 0.3V to +6.5V
INx, OEx (Note
3) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6.5V
Output Voltages
COMx (Note
3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6.5V
Continuous Current (NC2x, NO3x) . . . . . . . . . . . . . . . . . . . . ±40mA
Continuous Current (NC1x, NO4x) . . . . . . . . . . . . . . . . . . . ±150mA
Peak Current (NC2x, NO3x)
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . . . . . . . . ±100mA
Peak Current (NC1x, NO4x)
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . . . . . . . . ±300mA
ESD Rating:
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>8kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>400V
Charged Device Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>2kV
Thermal Resistance (Typical, Notes
4, 5)θJA (°C/W) θJC (°C/W)
32 Ld 5x5mm TQFN Package . . . . . . .
30
1.5
36 Ball WLCSP Package . . . . . . . . . . .
60
Maximum Junction Temperature (Plastic Package). . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . . -65°C to +150°C
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
Logic Control Input Voltage . . . . . . . . . . . . . . . . . . . . . . . 0V to VDD
Analog Signal Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to VDD
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
3. Signals on NCx, NOx, COMx, INx, and OEx exceeding VDD or GND by specified amount are clamped. Limit current to maximum current ratings.
4.
θ
JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379 for details.
5. For
θJC, the “case temperature” location is the center of the exposed metal pad on the package underside.
Electrical Specifications - 2.7V to 3.6V Supply
Test Conditions: VDD = +2.7V, GND = 0V, VINxH = 1.4V, VINxL = 0.5V,
VOExH = 1.4V, VOExL = 0.5V, (Note 6), Unless Otherwise Specified. PARAMETER
TEST CONDITIONS
TEMP
(°C)
MIN
MAX
ANALOG SWITCH CHARACTERISTICS
USB HS Switch, COM2x and COM3x
Analog Signal Range, VANALOG
Full
0
-
VDD
V
ON-Resistance, rON
High Speed
VDD = 2.7V, VOEx = VOExH, ICOMx = 40mA, VNOx or
VNCx = 0V to 400mV (see Figure 1) 25
-
8.3
-
Ω
Full
-
9.25
-
Ω
rON Matching Between Channels,
ΔrON, High Speed
VDD = 2.7V, VOEx = VOExH, ICOMx = 40mA, VNOx or
VNCx = Voltage at max rON, (Note 10) 25
-
0.11
-
Ω
Full
-
0.22
-
Ω
rON Flatness, rFLAT(ON)
High Speed
VDD = 2.7V, VOEx = VOExH, ICOMx = 40mA, VNOx or
VNCx = 0V to 400mV, (Note 9) 25
-
1.45
-
Ω
Full
-
1.8
-
Ω
ON-Resistance, rON
Full Speed
VDD = 2.7V, VOEx = VOExH, ICOMx = 1mA, VNOx or
VNCx =0V to 2.7V (see Figure 1, Note 11) 25
-
130
150
Ω
Full
-
150
178
Ω
rON Matching Between Channels,
ΔrON, Full-Speed
VDD = 2.7V, VOEx = VOExH, ICOMx = 1mA, VNOx or
VNCx = Voltage at max rON over signal range of 0V to 2.7V
25
-
1.2
-
Ω
Full
-
2.6
-
Ω
rON Flatness, rFLAT(ON)
Full-Speed
VDD = 2.7V, VOEx = VOExH, ICOMx = 1mA, VNOx or
25
-
4
-
Ω
Full
-
5
-
Ω
ON-Resistance, rON
VDD = 2.7V, VOEx = VOExH, ICOMx = 1mA, VNOx or
VNCx = 0V to 1.8V (see Figure 1) 25
-
128
-
Ω
Full
-
140
-
Ω
OFF Leakage Current, INOx(OFF) or
INCx(OFF)
VDD = 3.6V, VOEx = Such that switch is disabled,
VCOMx = 0.3V, 3.3V, VNOx = 3.3V, 0.3V, VNCx = 3.3V, 0.3V
25
-20
4
20
nA
Full
-100
-
100
nA
ON Leakage Current, ICOMx(ON)
VDD = 3.6V, VOEx = VOExH, VCOMx = 0.3V, 3.3V,
VNOx = 0.3V, 3.3V, VNCx = 0.3V, 3.3V
25
-50
4
50
nA
Full
-100
-
100
nA
ISL54230