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參數(shù)資料
| 型號(hào)： | ISL55143IRZEVAL1Z |
| 廠商： | Intersil |
| 文件頁數(shù)： | 2/14頁 |
| 文件大?。?/td> | 0K |
| 描述： | EVALUATION BOARD FOR ISL55143IRZ |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | * |
10
FN6230.3
April 4, 2013
ISL55141, ISL55142, ISL55143
Quad Flat No-Lead Plastic Package (QFN)
Micro Lead Frame Plastic Package (MLFP)
L16.4x4A
16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220-VGGD-10)
SYMBOL
MILLIMETERS
NOTES
MIN
NOMINAL
MAX
A
0.80
0.90
1.00
-
A1
-
0.05
-
A2
-
1.00
9
A3
0.20 REF
9
b
0.18
0.25
0.30
5, 8
D
4.00 BSC
-
D1
3.75 BSC
9
D2
2.30
2.40
2.55
7, 8
E
4.00 BSC
-
E1
3.75 BSC
9
E2
2.30
2.40
2.55
7, 8
e
0.50 BSC
-
k0.25
-
L
0.30
0.40
0.50
8
L1
-
0.15
10
N16
2
Nd
4
3
Ne
4
3
P-
-
0.60
9
θ
--
12
9
Rev. 2 3/06
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land
Pattern Design efforts, see Intersil Technical Brief TB389.
9. Features and dimensions A2, A3, D1, E1, P &
θ are present when
Anvil singulation method is used and not present for saw
singulation.
10. Depending on the method of lead termination at the edge of the
package, a maximum 0.15mm pull back (L1) maybe present.
L minus L1 to be equal to or greater than 0.3mm.
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| ISL55143IRZ-T | 功能描述:IC COMP CMOS HS 18V 36-TQFN RoHS:是 類別:集成電路 (IC) >> 線性 - 比較器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:- 類型:通用 元件數(shù):1 輸出類型:CMOS，推挽式，滿擺幅，TTL 電壓 - 電源，單路/雙路(±):2.5 V ~ 5.5 V，±1.25 V ~ 2.75 V 電壓 - 輸入偏移（最小值）:5mV @ 5.5V 電流 - 輸入偏壓（最小值）:1pA @ 5.5V 電流 - 輸出（標(biāo)準(zhǔn)）:- 電流 - 靜態(tài)（最大值）:24µA CMRR, PSRR（標(biāo)準(zhǔn)）:80dB CMRR，80dB PSRR 傳輸延遲（最大）:450ns 磁滯:±3mV 工作溫度:-40°C ~ 85°C 封裝/外殼:6-WFBGA，CSPBGA 安裝類型:表面貼裝 包裝:管件 其它名稱:Q3554586 |
| ISL55162 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:SOC Dual Channel 300MHz Pin Electronics/DAC/PMU/Deskew |
| ISL55164 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:SOC Dual Channel 133MHz Pin Electronics Solution 3.75ns Minimum Pulse Width |
| ISL55164CNEZ | 制造商:Intersil Corporation 功能描述: |
| ISL55187CRZ | 制造商:Intersil Corporation 功能描述:ISL55187CRZ PB-FREE SOC PIN ELECTRONICS COMPANION PMU/DAC/RE - Trays |
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