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參數(shù)資料
| 型號(hào)： | ISL5727 |
| 廠商： | Intersil Corporation |
| 英文描述： | Dual 10-bit, +3.3V, 260+MSPS, High Speed D/A Converter |
| 中文描述： | 雙10位，3.3伏，260 MSPS的，高速D / A轉(zhuǎn)換 |
| 文件頁(yè)數(shù)： | 4/13頁(yè) |
| 文件大?。?/td> | 672K |
| 代理商： | ISL5727 |
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4
Pin Descriptions
PIN NO.
PIN NAME
PIN DESCRIPTION
11, 19, 26
AGND
Analog ground.
13, 24
A
VDD
Analog supply (+2.7V to +3.6V).
28
CLK
Clock input.
27
DGND
Connect to digital ground.
10
D
VDD
Digital supply (+2.7V to +3.6V).
20
FSADJ
Full scale current adjust. Use a resistor to ground to adjust full scale output current. Full scale output
current = 32 x V
FSADJ
/R
SET
.
14, 23
NC
Not internally connected. Recommend no connect.
12, 25
ICOMP, QCOMP
Compensation pin for internal bias generation. Each pin should be individually decoupled to AGND with
a 0.1
μ
F capacitor.
1-4, 29-38,
43-48
ID9-ID0, QD9-QD0
Digital data input ports. Bit 9 is most significant bit (MSB) and bit 0 is the least significant bit (LSB).
15, 22
IOUTA, QOUTA
Current outputs of the device. Full scale output current is achieved when all input bits are set to binary 1.
16, 21
IOUTB, QOUTB
Complementary current outputs of the device. Full scale output current is achieved on the complementary
outputs when all input bits are set to binary 0.
17
REFIO
Reference voltage input if Internal reference is disabled. The internal reference is not intended to drive an
external load. Use 0.1
μ
F cap to ground when internal reference is enabled.
18
REFLO
Connect to analog ground to enable internal 1.2V reference or connect to AV
DD
to disable internal reference.
5-8, 39-42
NC
No connect (NC). Not internally connected. No termination required, may be used for device migration to
higher resolution DACs.
9
SLEEP
Connect to digital ground or leave floating for normal operation. Connect to DV
DD
for sleep mode.
ISL5727
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ISL5727IN | Dual 10-bit, +3.3V, 260+MSPS, High Speed D/A Converter |
| ISL5727EVAL1 | Dual 10-bit, +3.3V, 260+MSPS, High Speed D/A Converter |
| ISL57292IN | Dual 10-bit, +3.3V, 130/210MSPS, CommLink TM High Speed D/A Converter |
| ISL5729IN | Dual 10-bit, +3.3V, 130/210MSPS, CommLink TM High Speed D/A Converter |
| ISL5729EVAL1 | Dual 10-bit, +3.3V, 130/210MSPS, CommLink TM High Speed D/A Converter |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISL5727EVAL1 | 制造商:INTERSIL 制造商全稱(chēng):Intersil Corporation 功能描述:Dual 10-bit, +3.3V, 260+MSPS, High Speed D/A Converter |
| ISL5727IN | 功能描述:IC DAC DUAL 10BIT 260MSPS 48LQFP RoHS:否 類(lèi)別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:2,400 系列:- 設(shè)置時(shí)間:- 位數(shù):18 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:3 電壓電源:模擬和數(shù)字 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類(lèi)型:表面貼裝 封裝/外殼:36-TFBGA 供應(yīng)商設(shè)備封裝:36-TFBGA 包裝:帶卷 (TR) 輸出數(shù)目和類(lèi)型:* 采樣率（每秒）:* |
| ISL5727INZ | 功能描述:IC DAC DUAL 10BIT 3.3V 48-LQFP RoHS:是 類(lèi)別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1,000 系列:- 設(shè)置時(shí)間:1µs 位數(shù):8 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:8 電壓電源:雙 ± 功率耗散（最大）:941mW 工作溫度:0°C ~ 70°C 安裝類(lèi)型:表面貼裝 封裝/外殼:24-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:24-SOIC W 包裝:帶卷 (TR) 輸出數(shù)目和類(lèi)型:8 電壓，單極 采樣率（每秒）:* |
| ISL5729 | 制造商:INTERSIL 制造商全稱(chēng):Intersil Corporation 功能描述:Dual 10-bit, +3.3V, 130/210MSPS, CommLink TM High Speed D/A Converter |
| ISL5729/2IN | 功能描述:IC DAC DUAL 10BIT 3.3V 48-MQFP RoHS:否 類(lèi)別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:2,400 系列:- 設(shè)置時(shí)間:- 位數(shù):18 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:3 電壓電源:模擬和數(shù)字 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類(lèi)型:表面貼裝 封裝/外殼:36-TFBGA 供應(yīng)商設(shè)備封裝:36-TFBGA 包裝:帶卷 (TR) 輸出數(shù)目和類(lèi)型:* 采樣率（每秒）:* |
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