參數(shù)資料
型號: ISL59114IRUZ-EVALZ
廠商: Intersil
文件頁數(shù): 2/10頁
文件大?。?/td> 0K
描述: EVAL BOARD FOR ISL59114IRUZ
標準包裝: 1
系列: *
10
FN6184.2
September 21, 2006
ISL59114
Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN)
6
B
E
A
D
0.10 C
2X
2
0.10 M C A B
0.05 M C
(ND-1) X e
C
0.05 C
A
0.10 C
A1
SEATING PLANE
e
INDEX AREA
PIN #1 ID
3
5
(DATUM A)
(DATUM B)
N-1
1
N
NX L
NX b
2
1
N
TOP VIEW
BOTTOM VIEW
SIDE VIEW
NX (b)
SECTION "C-C"
FOR ODD TERMINAL/SIDE
e
CC
5
C
L
TERMINAL TIP
(A1)
L
DETAIL “A” PIN 1 ID
L
0.05 MIN
0.10 MIN
0.10 C
2X
4xk
b
L10.2.1x1.6A
10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC
PACKAGE
SYMBOL
MILLIMETERS
NOTES
MIN
NOMINAL
MAX
A
0.45
0.50
0.55
-
A1
-
0.05
-
A3
0.127 REF
-
b
0.15
0.20
0.25
5
D
2.05
2.10
2.15
-
E
1.55
1.60
1.65
-
e
0.50 BSC
-
k0.20
--
-
L
0.35
0.40
0.45
-
N10
2
Nd
4
3
Ne
1
3
θ
0-
12
4
Rev. 3 6/06
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on D and E side,
respectively.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Maximum package warpage is 0.05mm.
8. Maximum allowable burrs is 0.076mm in all directions.
9. Same as JEDEC MO-255UABD except:
No lead-pull-back, "A" MIN dimension = 0.45 not 0.50mm
"L" MAX dimension = 0.45 not 0.42mm.
10. For additional information, to assist with the PCB Land Pattern
Design effort, see Intersil Technical Brief TB389.
2.00
0.80
1.75
0.25
0.50
0.275
2.50
LAND PATTERN 10
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