26 Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems " />
參數(shù)資料
型號(hào)： ISL59605IRZ-T7
廠商： Intersil
文件頁(yè)數(shù)： 19/28頁(yè)
文件大小： 0K
描述： IC VIDEO EQUALIZER 20-QFN
產(chǎn)品培訓(xùn)模塊： ISL5960x MegaQ Overview
標(biāo)準(zhǔn)包裝： 1,000
系列： MegaQ™
類(lèi)型： 視頻均衡器
應(yīng)用： 安全系統(tǒng)，視頻路由
安裝類(lèi)型： 表面貼裝
封裝/外殼： 20-VFQFN 裸露焊盤(pán)
供應(yīng)商設(shè)備封裝： 20-QFN（4x4）
包裝： 帶卷 (TR)
ISL59601, ISL59602, ISL59603, ISL59604, ISL59605
26
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6739.2
September 5, 2012
For additional products, see www.intersil.com/product_tree
Bypassing and Layout
Considerations
MegaQ requires a dedicated ground plane in order to function
properly. For 2-layer boards, pour a quarter-inch ground plane
extending around the device on both the top and bottom layers.
Ensure that the ground plane on the bottom layer is a solid plane
with no traces cutting through it. Bypass capacitors must be
placed as close as possible to the device in order to ensure good
performance at longer lengths of equalization. Ensure that the
ground connections for the bypass capacitors connect directly to
the same uniform ground plane described previously.
General PowerPAD Design Considerations
The thermal pad must be connected to the ground plane for heat
dissipation. Figure 50 is an example of how to use vias to remove
heat from the IC.
The thermal pad is electrically connected to GND through the
high resistance IC substrate. We recommend you fill the thermal
pad area with vias. The via array should be centered in the
thermal pad and placed such that the center on center spacing is
3x the via radius. Vias should be small, but large enough to allow
solder wicking during reflow. Connect all vias to ground. It is
important the vias have a low thermal resistance for efficient
heat transfer. Do not use “thermal relief” patterns. It is important
to have a solid connection of the plated-through hole to each
plane.
Power Dissipation
The maximum power dissipation allowed in a package is
determined according to Equation 1:
Where:
TJMAX = Maximum junction temperature
TAMAX = Maximum ambient temperature
ΘJA = Thermal resistance of the package
The maximum power dissipation actually produced by an IC is
the total quiescent supply current times the total power supply
voltage, plus the power in the IC due to the load, or:
for sourcing use Equation 2:
for sinking use Equation 3:
Where:
VS = Supply voltage
ISMAX = Maximum quiescent supply current
VOUT = Maximum output voltage of the application
RLOAD = Load resistance tied to ground
ILOAD = Load current
FIGURE 50. PCB VIA PATTERN
PDMAX
TJMAX TAMAX
–
ΘJA
----------------------------------------
=
(EQ. 1)
PDMAX
VS ISMAX VS VOUT
–
()
+
×
VOUT
RL
-------------
×
=
(EQ. 2)
PDMAX
VS ISMAX VOUT VS
–
()
+
×
ILOAD
×
=
(EQ. 3)
相關(guān)PDF資料
PDF描述
VE-B5J-IV-F4 CONVERTER MOD DC/DC 36V 150W
97-3102A-16S-8S CONN RECEPT BOX MNT 5POS W/SOCK
MAX1087ETA+T IC ADC 10BIT 150KSPS 8-TDFN
ISL98001CQZ-140 IC TRPL VIDEO DIGITIZER 128-MQFP
ISL59604IRZ-T7 IC VIDEO EQUALIZER 20-QFN
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISL59605IRZ-T7A 功能描述:IC VIDEO EQUALIZER 20-QFN RoHS:是 類(lèi)別:集成電路 (IC) >> 線性 - 視頻處理 系列:MegaQ™ 產(chǎn)品變化通告:Product Discontinuation 07/Mar/2011 標(biāo)準(zhǔn)包裝:3,000 系列:OMNITUNE™ 類(lèi)型:調(diào)諧器 應(yīng)用:移動(dòng)電話，手機(jī)，視頻顯示器 安裝類(lèi)型:表面貼裝 封裝/外殼:65-WFBGA 供應(yīng)商設(shè)備封裝:PG-WFSGA-65 包裝:帶卷 (TR) 其它名稱(chēng):SP000365064
ISL59605-SPI-EVALZ 功能描述:EVAL BOARD FOR ISL5960X RoHS:是 類(lèi)別:編程器，開(kāi)發(fā)系統(tǒng) >> 評(píng)估演示板和套件 系列:* 標(biāo)準(zhǔn)包裝:1 系列:PCI Express® (PCIe) 主要目的:接口，收發(fā)器，PCI Express 嵌入式:- 已用 IC / 零件:DS80PCI800 主要屬性:- 次要屬性:- 已供物品:板
ISL5960X-EVALZ 制造商:INTERSIL 制造商全稱(chēng):Intersil Corporation 功能描述:MegaQ: An Automatic Composite Video Equalizer, Fully-Adaptive to 1 Mile (1600m)
ISL5960X-SPI-EVALZ 制造商:INTERSIL 制造商全稱(chēng):Intersil Corporation 功能描述:MegaQ: An Automatic Composite Video Equalizer, Fully-Adaptive to 1 Mile (1600m)
ISL5961 制造商:INTERSIL 制造商全稱(chēng):Intersil Corporation 功能描述:14-Bit, +3.3V, 130/210+MSPS, High Speed D/A Converter
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*