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參數(shù)資料
| 型號： | ISL6141CB-T |
| 廠商： | INTERSIL CORP |
| 元件分類： | 電源管理 |
| 英文描述： | Negative Voltage Hot Plug Controller |
| 中文描述： | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO8 |
| 封裝： | PLASTIC, MS-012AA, SOIC-8 |
| 文件頁數(shù)： | 18/19頁 |
| 文件大?。?/td> | 428K |
| 代理商： | ISL6141CB-T |
18
Applications: Layout Considerations
For the minimum application, there are only 6 resistors, 2
capacitors, one IC and one FET. A sample layout is shown in
Figure 35. It assumes the IC is 8-SOIC; the FET is in a
D2PAK (or similar SMD-220 package).
Although GND planes are common with multi-level PCBs, for
a -48V system, the -48V rails (both input and output) act
more like a GND than the top 0V rail (mainly because the IC
signals are mostly referenced to the lower rail). So if
separate planes for each voltage are not an option, consider
prioritizing the bottom rails first.
Note that with the placement shown, most of the signal lines
are short, and there should not be minimal interaction
between them.
Although decoupling capacitors across the IC supply pins
are often recommended in general, this application may not
need one, nor even tolerate one. For one thing, a decoupling
cap would add to (or be swamped out by) any other input
capacitance; it also needs to be charged up when power is
applied. But more importantly, there are no high speed (or
any) input signals to the IC that need to be conditioned. If still
desired, consider the isolation resistor R10, as shown in
Figure 34.
NOTES:
1. Layout scale is approximate; routing lines are just for illustration
purposes; they do not necessarily conform to normal PCB
design rules. High current buses are wider, shown with parallel
lines.
2. Approximate size of the above layout is 1.6 x 0.6 inches; almost
half of the area is just the FET (D2PAK or similar SMD-220
package).
3. R1 sense resistor is size 2512; all other R’s and C’s shown are
0805; they can all potentially use smaller footprints, if desired.
4. The RL and CL are not shown on the layout.
5. R4 uses a via to connect to GND on the bottom of the board; all
other routing can be on top level. (It’s even possible to eliminate
the via, for an all top-level route).
6. PWRGD signal is not used here.
BOM (Bill Of Materials)
R1 = 0.02
(5%)
R2 = 10
(5%)
R3 = 18k
(5%)
R4 = 549k
(1%)
R5 = 6.49k
(1%)
R6 = 10k
(1%)
C1 = 150nF (25V)
C2 = 3.3nF (100V)
Q1 = IRF530 (100V, 17A, 0.11
)
G 6
D 7
VDD 8
2 OV
3 UV
4 VEE
1 PG
S 5
U1
R1
R5
G
S
DRAIN
FET
R4
R3
C2
R2
R6
C1
-48V IN
GND
GND
-48V OUT
ISL6141
V
DD
UV
OV
V
EE
SENSE
GATE
DRAIN
PWRGD
R4
R5
R6
R1
R2
R3
C2
C1
Q1
CL
GND
GND
-48V IN
-48V OUT
RL
(LOAD)
FIGURE 35. ISL6141/51 SAMPLE LAYOUT (NOT TO SCALE)
ISL6141, ISL6151
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| ISL6141CBZA | 功能描述:IC CONTROLLER HOT PLUG 8-SOIC RoHS:是 類別:集成電路 (IC) >> PMIC - 熱交換 系列:- 產(chǎn)品培訓(xùn)模塊:Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:100 系列:- 類型:熱插拔開關(guān) 應(yīng)用:通用 內(nèi)部開關(guān):是 電流限制:可調(diào) 電源電壓:9 V ~ 13.2 V 工作溫度:-40°C ~ 150°C 安裝類型:表面貼裝 封裝/外殼:10-WFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:10-TDFN-EP（3x3） 包裝:管件 |
| ISL6141CBZA-T | 功能描述:IC CTRLR HOT PLUG NEG VOLT 8SOIC RoHS:是 類別:集成電路 (IC) >> PMIC - 熱交換 系列:- 產(chǎn)品培訓(xùn)模塊:Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:100 系列:- 類型:熱插拔開關(guān) 應(yīng)用:通用 內(nèi)部開關(guān):是 電流限制:可調(diào) 電源電壓:9 V ~ 13.2 V 工作溫度:-40°C ~ 150°C 安裝類型:表面貼裝 封裝/外殼:10-WFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:10-TDFN-EP（3x3） 包裝:管件 |
| ISL6141IB | 功能描述:IC CTRLR HOT PLUG NEG VOLT 8SOIC RoHS:否 類別:集成電路 (IC) >> PMIC - 熱交換 系列:- 產(chǎn)品培訓(xùn)模塊:Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:100 系列:- 類型:熱插拔開關(guān) 應(yīng)用:通用 內(nèi)部開關(guān):是 電流限制:可調(diào) 電源電壓:9 V ~ 13.2 V 工作溫度:-40°C ~ 150°C 安裝類型:表面貼裝 封裝/外殼:10-WFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:10-TDFN-EP（3x3） 包裝:管件 |
| ISL6141IB-T | 功能描述:IC CTRLR HOT PLUG NEG VOLT 8SOIC RoHS:否 類別:集成電路 (IC) >> PMIC - 熱交換 系列:- 產(chǎn)品培訓(xùn)模塊:Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:100 系列:- 類型:熱插拔開關(guān) 應(yīng)用:通用 內(nèi)部開關(guān):是 電流限制:可調(diào) 電源電壓:9 V ~ 13.2 V 工作溫度:-40°C ~ 150°C 安裝類型:表面貼裝 封裝/外殼:10-WFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:10-TDFN-EP（3x3） 包裝:管件 |
| ISL6141IBZA | 功能描述:IC CTRLR HOT PLUG NEG VOLT 8SOIC RoHS:是 類別:集成電路 (IC) >> PMIC - 熱交換 系列:- 產(chǎn)品培訓(xùn)模塊:Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:100 系列:- 類型:熱插拔開關(guān) 應(yīng)用:通用 內(nèi)部開關(guān):是 電流限制:可調(diào) 電源電壓:9 V ~ 13.2 V 工作溫度:-40°C ~ 150°C 安裝類型:表面貼裝 封裝/外殼:10-WFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:10-TDFN-EP（3x3） 包裝:管件 |
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