參數(shù)資料
型號(hào): ISL6523CBZ-T
廠商: INTERSIL CORP
元件分類(lèi): 穩(wěn)壓器
英文描述: VRM8.5 Dual PWM and Dual Linear Power System Controller
中文描述: DUAL SWITCHING CONTROLLER, 215 kHz SWITCHING FREQ-MAX, PDSO28
封裝: LEAD FREE, PLASTIC, MS-013AE, SOIC-28
文件頁(yè)數(shù): 13/16頁(yè)
文件大小: 498K
代理商: ISL6523CBZ-T
13
transient current level must be supplied by the output
capacitor(s). Minimizing the response time can minimize the
output capacitance required.
The response time to a transient is different for the
application of load and the removal of load. The following
equations give the approximate response time interval for
application and removal of a transient load:
where: I
TRAN
is the transient load current step, t
RISE
is the
response time to the application of load, and t
FALL
is the
response time to the removal of load. Be sure to check both
of these equations at the minimum and maximum output
levels for the worst case response time.
Input Capacitor Selection
The important parameters for the bulk input capacitor are the
voltage rating and the RMS current rating. For reliable
operation, select bulk input capacitors with voltage and
current ratings above the maximum input voltage and largest
RMS current required by the circuit. The capacitor voltage
rating should be at least 1.25 times greater than the
maximum input voltage. The maximum RMS current rating
requirement for the input capacitors of a buck regulator is
approximately 1/2 of the DC output load current. Worst-case
RMS current draw in a circuit employing the ISL6523
amounts to the largest RMS current draw of either switching
regulator (likely the RMS of V
OUT1
). Operating at 180
o
out-
of-phase, the input-side RMS current of both switchers is
less than the arithmetical sum of individual RMS input
currents.
Use a mix of input bypass capacitors to control the voltage
overshoot across the MOSFETs. Use ceramic capacitance
for the high frequency decoupling and bulk capacitors to
supply the RMS current. Small ceramic capacitors can be
placed very close to the upper MOSFET to suppress the
voltage induced in the parasitic circuit impedances.
For a through-hole design, several electrolytic capacitors
(Panasonic HFQ series or Nichicon PL series or Sanyo
MV-GX or equivalent) may be needed. For surface mount
designs, solid tantalum capacitors can be used, but caution
must be exercised with regard to the capacitor surge current
rating. These capacitors must be capable of handling the
surge current at power-up. The TPS series available from
AVX, and the 593D series from Sprague are both surge
current tested.
MOSFET Selection/Considerations
The ISL6523 requires 5 external transistors. Three
N-channel MOSFETs are employed by the PWM converters.
The AGP and memory linear controllers can each drive a
MOSFET or a NPN bipolar as a pass transistor. All these
transistors should be selected based upon r
DS(ON)
, current
gain, saturation voltages, gate supply requirements, and
thermal management considerations.
PWM1 MOSFET Selection and Considerations
In high-current PWM applications, the MOSFET power
dissipation, package selection and heatsink are the dominant
design factors. The power dissipation includes two main loss
components: conduction losses and switching losses. These
losses are distributed between the upper and lower MOSFETs
according to the duty factor. The conduction losses are the
main component of power dissipation for the lower MOSFETs.
Only the upper MOSFET has significant switching losses, since
the lower device turns on and off into near zero voltage.
The equations presented assume linear voltage-current
transitions and do not model power losses due to the lower
MOSFET’s body diode or the output capacitances
associated with either MOSFET. The gate charge losses are
dissipated by the controller IC (ISL6523) and do not
contribute to the MOSFETs’ heat rise. Ensure that both
MOSFETs are within their maximum junction temperature at
high ambient temperature by calculating the temperature
rise according to package thermal resistance specifications.
A separate heatsink may be necessary depending upon
MOSFET power, package type, ambient temperature and air
flow.
The r
DS(ON)
is different for the two equations above even if
the same device is used for both. This is because the gate
drive applied to the upper MOSFET is different than the
lower MOSFET. Figure 12 shows the gate drive where the
upper MOSFET’s gate-to-source voltage is approximately
V
CC
less the input supply. For +5V main power and +12VDC
for the bias, the approximate gate-to-source voltage of Q1 is
7V. The lower gate drive voltage is 12V. A logic-level MOSFET
is a good choice for Q1 and a logic-level MOSFET can be
used for Q2 if its absolute gate-to-source voltage rating
exceeds the maximum voltage applied to V
CC
.
Rectifier CR1 is a clamp that catches the negative inductor
swing during the dead time between the turn off of the lower
MOSFET and the turn on of the upper MOSFET. For best
results, the diode must be a surface-mount Schottky type to
prevent the parasitic MOSFET body diode from conducting. It
is acceptable to omit the diode and let the body diode of the
lower MOSFET clamp the negative inductor swing, but one
must ensure the PHASE node negative voltage swing does
not exceed -3V to -5V peak. The diode's rated reverse
breakdown voltage must be equal or greater to 1.5 times the
maximum input voltage.
PWM2 MOSFET and Schottky Selection
t
RISE
L
IN
I
OUT
×
----------–
=
t
FALL
L
------------------------------
I
OUT
×
=
P
UPPER
I
------------------------------------------------------------
2
r
IN
×
V
×
I
----------------------------------------------------
V
×
t
×
F
S
×
+
=
P
LOWER
I
--------------------------------------------------------------------------------
2
r
IN
×
V
V
(
)
×
=
ISL6523
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