參數(shù)資料
型號: ISL6563IR-T
廠商: INTERSIL CORP
元件分類: 穩(wěn)壓器
英文描述: Two-Phase Multi-Phase Buck PWM Controller with Integrated MOSFET Drivers
中文描述: SWITCHING CONTROLLER, 255 kHz SWITCHING FREQ-MAX, PQCC24
封裝: 4 X 4 MM, PLASTIC, MO-220-VGGD-2, QFN-24
文件頁數(shù): 17/19頁
文件大?。?/td> 516K
代理商: ISL6563IR-T
17
FN9126.6
April 13, 2005
Component Selection Guidelines
Output Capacitor Selection
The output capacitor is selected to meet both the dynamic
load requirements and the voltage ripple requirements. The
load transient a microprocessor impresses is characterized
by high slew rate (di/dt) current demands. In general,
multiple high quality capacitors of different size and dielectric
are paralleled to meet the design constraints.
Should the load be characterized by high slew rates, attention
should be particularly paid to the selection and placement of
high-frequency decoupling capacitors (MLCCs, typically -
multi-layer ceramic capacitors). High frequency capacitors
supply the initially transient current and slow the load rate-of-
change seen by the bulk capacitors. The bulk filter capacitor
values are generally determined by the ESR (effective series
resistance) and capacitance requirements.
High frequency decoupling capacitors should be placed as
close to the power pins of the load, or for that reason, to any
decoupling target they are meant for, as physically possible.
Attention should be paid as not to add inductance in the
circuit board wiring that could cancel the usefulness of these
low inductance components. Consult with the manufacturer
of the load on specific decoupling requirements.
Use only specialized low-ESR capacitors intended for
switching-regulator applications for the bulk capacitors. The
bulk capacitor’s ESR determines the output ripple voltage
and the initial voltage drop following a high slew-rate
transient’s edge. In most cases, multiple capacitors of small
case size perform better than a single large case capacitor.
Bulk capacitor choices include aluminum electrolytic, OS-Con,
Tantalum and even ceramic dielectrics. An aluminum
electrolytic capacitor’s ESR value is related to the case size
VIA CONNECTION TO GROUND PLANE
ISLAND ON POWER PLANE LAYER
ISLAND ON CIRCUIT PLANE LAYER
KEY
LOCATE CLOSE TO IC
(MINIMIZE CONNECTION PATH)
FIGURE 9. PRINTED CIRCUIT BOARD POWER PLANES AND ISLANDS
LOCATE NEAR LOAD;
(MINIMIZE CONNECTION PATH)
ISL6563
+12V
IN
Q1
Q2
Q3
Q4
VID4
VID3
VID2
VID1
VID0
COMP
FB
GND
VCC
BOOT1
BOOT2
UGATE1
UGATE2
ISEN
LGATE1
LGATE2
L
IN
L
OUT1
(C
HFIN1
)
C
BIN1
(C
HFIN2
)
C
BIN2
C
BOOT1
C
BOOT2
L
OUT2
(C
HFOUT
)
C
BOUT
R
ISEN
R
2
R
1
C
1
C
2
(C
F1
)
PHASE1
PHASE2
V
OUT
PGND
PVCC
(C
F2
)
+5V
IN
DACSEL/VID12
VRM10
SSEND
ENLL
R
OFS
OFS
R’
OFS
HEAVY TRACE ON CIRCUIT PLANE LAYER
LOCATE NEAR SWITCHING TRANSISTORS;
(MINIMIZE CONNECTION PATH)
ISL6563
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