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參數(shù)資料
| 型號(hào)： | ISL6605IB-T |
| 廠商： | INTERSIL CORP |
| 元件分類： | 功率晶體管 |
| 英文描述： | Circular Connector; Body Material:Aluminum; Series:PT06; No. of Contacts:55; Connector Shell Size:22; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Circular Contact Gender:Pin; Insert Arrangement:22-55 |
| 中文描述： | 4 A HALF BRDG BASED MOSFET DRIVER, PDSO8 |
| 封裝： | PLASTIC, MS-012AA, SOIC-8 |
| 文件頁數(shù)： | 5/9頁 |
| 文件大?。?/td> | 302K |
| 代理商： | ISL6605IB-T |
5
FN9091.5
January 4, 2005
Functional Pin Description
Note: Pin numbers refer to the SOIC package. Check
PINOUT diagrams for QFN pin numbers.
UGATE (Pin 1)
Upper gate drive output. Connect to gate of high-side power
N-Channel MOSFET.
BOOT (Pin 2)
Floating bootstrap supply pin for the upper gate drive.
Connect the bootstrap capacitor between this pin and the
PHASE pin. The bootstrap capacitor provides the charge to
turn on the upper MOSFET. See the Bootstrap Diode and
Capacitor section under DESCRIPTION for guidance in
choosing the appropriate capacitor value.
PWM (Pin 3)
The PWM signal is the control input for the driver. The PWM
signal can enter three distinct states during operation (see the
three-state PWM Input section under DESCRIPTION for further
details). Connect this pin to the PWM output of the controller.
GND (Pin 4)
Ground pin. All signals are referenced to this node.
LGATE (Pin 5)
Lower gate drive output. Connect to gate of the low-side
power N-Channel MOSFET.
VCC (Pin 6)
Connect this pin to a +5V bias supply. Place a high quality
bypass capacitor from this pin to GND.
EN (Pin 7)
Enable input pin. Connect this pin to HIGH to enable and
LOW to disable the IC. When disabled, the IC draws less
than 1
μ
A bias current.
PHASE (Pin 8)
Connect this pin to the source of the upper MOSFET and the
drain of the lower MOSFET. This pin provides a return path
for the upper gate driver.
Thermal Pad (in QFN only)
In the QFN package, the pad underneath the center of the
IC is a thermal substrate. The PCB “thermal land” design
for this exposed die pad should include thermal vias that
drop down and connect to one or more buried copper
plane(s). This combination of vias for vertical heat escape
and buried planes for heat spreading allows the QFN to
achieve its full thermal potential. This pad should be either
grounded or floating, and it should not be connected to
other nodes. Refer to TB389 for design guidelines.
Description
Operation
Designed for speed, the ISL6605 MOSFET driver controls both
high-side and low-side N-Channel FETs from one externally
provided PWM signal.
A rising edge on PWM initiates the turn-off of the lower
MOSFET (see Timing Diagram). After a short propagation
delay [t
PDLLGATE
], the lower gate begins to fall. Typical fall
times [t
FLGATE
] are provided in the Electrical Specifications
section. Adaptive shoot-through circuitry monitors the
LGATE voltage and determines the upper gate delay time
[t
PDHUGATE
] based on how quickly the LGATE voltage drops
below 1V. This prevents both the lower and upper MOSFETs
from conducting simultaneously or shoot-through. Once this
delay period is completed the upper gate drive begins to rise
[t
RUGATE
] and the upper MOSFET turns on.
A falling transition on PWM indicates the turn-off of the upper
MOSFET and the turn-on of the lower MOSFET. A short
propagation delay [t
PDLUGATE
] is encountered before the
upper gate begins to fall [t
FUGATE
]. Again, the adaptive shoot-
through circuitry determines the lower gate delay time,
t
PDHLGATE
. The upper MOSFET gate voltage is monitored
and the lower gate is allowed to rise after the upper MOSFET
gate-to-source voltage
drops below 1V. The lower gate then
rises [t
RLGATE
], turning on the lower MOSFET.
Timing Diagram
PWM
UGATE
LGATE
t
PDLLGATE
t
FLGATE
t
PDHUGATE
t
RUGATE
t
PDLUGATE
t
FUGATE
t
PDHLGATE
t
RLGATE
ISL6605
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PDF描述 |
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| ISL6605IBZ | Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT06; Number of Contacts:55; Connector Shell Size:22; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Body Style:Straight |
| ISL6605IBZA | Circular Connector; Body Material:Aluminum; Series:PT06; No. of Contacts:55; Connector Shell Size:22; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Circular Contact Gender:Socket; Insert Arrangement:22-55 |
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| ISL6612AEIBZ-T | Circular Connector; No. of Contacts:46; Series:MS27466; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:25; Circular Contact Gender:Pin; Circular Shell Style:Wall Mount Receptacle; Insert Arrangement:25-46 RoHS Compliant: No |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISL6605IBZ | 功能描述:IC DRIVER MOSFET DUAL SYNC 8SOIC RoHS:是 類別:集成電路 (IC) >> PMIC - MOSFET，電橋驅(qū)動(dòng)器 - 外部開關(guān) 系列:- 標(biāo)準(zhǔn)包裝:95 系列:- 配置:半橋 輸入類型:PWM 延遲時(shí)間:25ns 電流 - 峰:1.6A 配置數(shù):1 輸出數(shù):2 高端電壓 - 最大（自引導(dǎo)啟動(dòng)）:118V 電源電壓:9 V ~ 14 V 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-SOIC 包裝:管件 產(chǎn)品目錄頁面:1282 (CN2011-ZH PDF) 其它名稱:*LM5104M*LM5104M/NOPBLM5104M |
| ISL6605IBZ-T | 功能描述:IC MOSFET DRVR SYNC BUCK 8-SOIC RoHS:是 類別:集成電路 (IC) >> PMIC - MOSFET，電橋驅(qū)動(dòng)器 - 外部開關(guān) 系列:- 標(biāo)準(zhǔn)包裝:5 系列:- 配置:低端 輸入類型:非反相 延遲時(shí)間:600ns 電流 - 峰:12A 配置數(shù):1 輸出數(shù):1 高端電壓 - 最大（自引導(dǎo)啟動(dòng)）:- 電源電壓:14.2 V ~ 15.8 V 工作溫度:-20°C ~ 60°C 安裝類型:通孔 封裝/外殼:21-SIP 模塊 供應(yīng)商設(shè)備封裝:模塊 包裝:散裝 配用:BG2A-NF-ND - KIT DEV BOARD FOR IGBT 其它名稱:835-1063 |
| ISL6605IR | 功能描述:IC MOSFET DRVR SYNC BUCK 8-QFN RoHS:否 類別:集成電路 (IC) >> PMIC - MOSFET，電橋驅(qū)動(dòng)器 - 外部開關(guān) 系列:- 標(biāo)準(zhǔn)包裝:50 系列:- 配置:低端 輸入類型:非反相 延遲時(shí)間:40ns 電流 - 峰:9A 配置數(shù):1 輸出數(shù):1 高端電壓 - 最大（自引導(dǎo)啟動(dòng)）:- 電源電壓:4.5 V ~ 35 V 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:TO-263-6，D²Pak（5 引線+接片），TO-263BA 供應(yīng)商設(shè)備封裝:TO-263 包裝:管件 |
| ISL6605IRR5168 | 制造商:Intersil Corporation 功能描述: |
| ISL6605IR-T | 功能描述:IC MOSFET DRVR SYNC BUCK 8-QFN RoHS:否 類別:集成電路 (IC) >> PMIC - MOSFET，電橋驅(qū)動(dòng)器 - 外部開關(guān) 系列:- 標(biāo)準(zhǔn)包裝:50 系列:- 配置:低端 輸入類型:非反相 延遲時(shí)間:40ns 電流 - 峰:9A 配置數(shù):1 輸出數(shù):1 高端電壓 - 最大（自引導(dǎo)啟動(dòng)）:- 電源電壓:4.5 V ~ 35 V 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:TO-263-6，D²Pak（5 引線+接片），TO-263BA 供應(yīng)商設(shè)備封裝:TO-263 包裝:管件 |
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