4
FN6050.7
July 31, 2006
Absolute Maximum Ratings
Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V)
Input/Output Voltages
A/Y, B/Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +12.5V
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V)
Short Circuit Duration
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating
HBM (Per MIL-STD-883, Method 3015.7) . . . . . . . . . . . . . . >7kV
Operating Conditions
Temperature Range
ISL8XXXIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to 85°C
Thermal Resistance (Typical, Note 1)
θ
JA (°C/W)
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .
170
8 Ld PDIP Package* . . . . . . . . . . . . . . . . . . . . . . . .
140
Maximum Junction Temperature (Plastic Package) . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . . . . -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C
(SOIC - Lead Tips Only)
*Pb-free PDIPs can be used for through hole wave solder
processing only. They are not intended for use in Reflow solder
processing applications.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1.
θ
JA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = 25°C,
(Note 2)
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
(°C)
MIN
TYP
MAX
UNITS
DC CHARACTERISTICS
Driver Differential VOUT (no load)
VOD1
Full
-
VCC
V
Driver Differential VOUT (with load)
VOD2
R = 50
Full
2
3
-
V
R = 27
Full
1.5
2.3
5
V
Change in Magnitude of Driver
Differential VOUT for
Complementary Output States
ΔVOD
R = 27
Full
-
0.01
0.2
V
Driver Common-Mode VOUT
VOC
R = 27
Full
-
3
V
Change in Magnitude of Driver
Common-Mode VOUT for
Complementary Output States
ΔV
OC
R = 27
Full
-
0.01
0.2
V
Logic Input High Voltage
VIH
DE, DI, RE
Full
2
-
V
Logic Input Low Voltage
VIL
DE, DI, RE
Full
-
0.8
V
Logic Input Current
IIN1
DE, DI, RE
Full
-2
-
2
μA
Input Current (A/Y, B/Z), (Note 10)
(ISL81483, ISL81487)
IIN2
DE = 0V, VCC = 4.5 to
5.5V
VIN = 12V
Full
-
140
μA
VIN = -7V
Full
-
-120
μA
IIN2
DE = 0V, VCC = 0V
VIN = 12V
Full
-
180
μA
VIN = -7V
Full
-
-100
μA
Input Current (A/Y, B/Z), (Note 11)
(ISL8487 Only)
IIN2
DE = 0V, VCC = 0V, or
4.5 to 5.5V
VIN = 12V
Full
-
250
μA
VIN = -7V
Full
-
-100
μA
Receiver Differential Threshold
Voltage
VTH
-7V
≤ VCM ≤ 12V
Full
-0.2
-
0.2
V
Receiver Input Hysteresis
ΔV
TH
VCM = 0V
25
-
70
-
mV
Receiver Output High Voltage
VOH
IO = -4mA, VID = 200mV
Full
3.5
-
V
Receiver Output Low Voltage
VOL
IO = -4mA, VID = 200mV
Full
-
0.4
V
Three-State (high impedance)
Receiver Output Current
IOZR
0.4V
≤ V
O ≤ 2.4V
Full
-
±1
μA
ISL8487, ISL81483, ISL81487