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參數(shù)資料
| 型號(hào)： | ISL83083EIB |
| 廠商： | Intersil |
| 文件頁數(shù)： | 8/19頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC TXRX RS485/422 5V ESD 14SOIC |
| 標(biāo)準(zhǔn)包裝： | 50 |
| 類型： | 收發(fā)器 |
| 驅(qū)動(dòng)器/接收器數(shù)： | 1/1 |
| 規(guī)程： | RS422，RS485 |
| 電源電壓： | 4.5 V ~ 5.5 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 14-SOIC（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 14-SOICN |
| 包裝： | 管件 |
16
FN6085.9
April 22, 2008
ISL83080E, ISL83082E, ISL83083E, ISL83084E, ISL83085E, ISL83086E, ISL83088E
Mini Small Outline Plastic Packages (MSOP)
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions
and are measured at Datum Plane.
Interlead flash and
protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. Formed leads shall be planar with respect to one another within
0.10mm (0.004) at seating Plane.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Datums
and
to be determined at Datum plane
.
11. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are for reference only.
L
0.25
(0.010)
L1
R1
R
4X
θ
4X
θ
GAUGE
PLANE
SEATING
PLANE
E
E1
N
12
TOP VIEW
INDEX
AREA
-C-
-B-
0.20 (0.008)
A
B C
SEATING
PLANE
0.20 (0.008)
C
0.10 (0.004)
C
-A-
-H-
SIDE VIEW
b
e
D
A
A1
A2
-B-
END VIEW
0.20 (0.008)
C
D
E1
CL
C
a
- H -
-A -
- B -
- H -
M8.118 (JEDEC MO-187AA)
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.037
0.043
0.94
1.10
-
A1
0.002
0.006
0.05
0.15
-
A2
0.030
0.037
0.75
0.95
-
b
0.010
0.014
0.25
0.36
9
c
0.004
0.008
0.09
0.20
-
D
0.116
0.120
2.95
3.05
3
E1
0.116
0.120
2.95
3.05
4
e
0.026 BSC
0.65 BSC
-
E
0.187
0.199
4.75
5.05
-
L
0.016
0.028
0.40
0.70
6
L1
0.037 REF
0.95 REF
-
N8
8
7
R
0.003
-
0.07
-
R1
0.003
-
0.07
-
0
5o
15o
5o
15o
-
α
0o
6o
0o
6o
-
Rev. 2 01/03
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISL83083EIB-T | 功能描述:IC TXRX RS485/422 5V ESD 14-SOIC RoHS:否 類別:集成電路 (IC) >> 接口 - 驅(qū)動(dòng)器，接收器，收發(fā)器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:25 系列:- 類型:收發(fā)器 驅(qū)動(dòng)器/接收器數(shù):2/2 規(guī)程:RS232 電源電壓:4.5 V ~ 5.5 V 安裝類型:通孔 封裝/外殼:16-DIP（0.300"，7.62mm） 供應(yīng)商設(shè)備封裝:16-PDIP 包裝:管件 |
| ISL83083EIBZ | 功能描述:RS-422/RS-485 接口 IC W/ANNEAL 14LD -40+85 3V RS-485 TRANS RoHS:否 制造商:Maxim Integrated 數(shù)據(jù)速率:1136 Kbps 工作電源電壓:3 V to 5.5 V 電源電流:5.9 mA 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-28 封裝:Tube |
| ISL83083EIBZ-T | 功能描述:RS-422/RS-485 接口 IC W/ANNEAL 14LD -40+85 3V RS-485 TRANS RoHS:否 制造商:Maxim Integrated 數(shù)據(jù)速率:1136 Kbps 工作電源電壓:3 V to 5.5 V 電源電流:5.9 mA 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-28 封裝:Tube |
| ISL83083EIUZ | 功能描述:RS-422/RS-485 接口 IC W/ANNEAL 10LD -40+85 5V RS-485 TRANSC RoHS:否 制造商:Maxim Integrated 數(shù)據(jù)速率:1136 Kbps 工作電源電壓:3 V to 5.5 V 電源電流:5.9 mA 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-28 封裝:Tube |
| ISL83083EIUZ-T | 功能描述:RS-422/RS-485 接口 IC W/ANNEAL 10LD -40+85 5V RS-485 TRANSC RoHS:否 制造商:Maxim Integrated 數(shù)據(jù)速率:1136 Kbps 工作電源電壓:3 V to 5.5 V 電源電流:5.9 mA 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-28 封裝:Tube |
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