All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certificati" />
參數(shù)資料
型號: ISL84684IIZ-T
廠商: Intersil
文件頁數(shù): 3/11頁
文件大?。?/td> 0K
描述: IC SWITCH DUAL SPDT 10WLCSP
標準包裝: 1
功能: 開關
電路: 2 x SPDT
導通狀態(tài)電阻: 500 毫歐
電壓電源: 單電源
電壓 - 電源,單路/雙路(±): 1.8 V ~ 4.5 V
電流 - 電源: 5nA
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 10-UFBGA,WLCSP
供應商設備封裝: 10-WLCSP(2.0x1.5)
包裝: 剪切帶 (CT)
其它名稱: ISL84684IIZ-TCT
11
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6190.0
November 3, 2005
ISL84684II
Wafer Level Chip Scale Package (WLCSP)
PIN 1 ID
A
E1
SD
BOTTOM VIEW
A
B
12
C
SE
3
4
b
e
D1
SIDE VIEW
A1
b
A2
TOP VIEW
bb
D
E
W4x3.10A
4X3 ARRAY 10 BALL WAFER LEVEL CHIP SCALE PACKAGE
SYMBOL
MILLIMETERS
NOTES
A
0.64 +0.05 -0.10
-
A1
0.29 ±0.02
-
A2
0.35 REF.
-
b
θ 0.37 ±0.03
-
bb
θ 0.30 REF.
-
D
1.50 ±0.05
-
D1
1.00 BASIC
-
E
2.00 ±0.05
-
E1
1.50 BASIC
-
e
0.50 BASIC
-
SD
0.00 BASIC
-
SE
0.25 BASIC
-
N10
3
Rev. 1 10/05
NOTES:
1. Dimensions are in Millimeters.
2. Dimensioning and tolerancing conform to ASME 14.5M-1994.
3. Symbol “N” is the actual number of solder balls.
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