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| 型號： | ISL84782IV-T |
| 廠商： | Intersil |
| 文件頁數(shù)： | 6/12頁 |
| 文件大小： | 0K |
| 描述： | IC MUX/DEMUX DUAL 4X1 16TSSOP |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 功能： | 多路復(fù)用器/多路分解器 |
| 電路： | 2 x 4:1 |
| 導(dǎo)通狀態(tài)電阻： | 750 毫歐 |
| 電壓電源： | 單電源 |
| 電壓 - 電源，單路/雙路(±)： | 1.6 V ~ 3.6 V |
| 電流 - 電源： | 50nA |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-TSSOP（0.173"，4.40mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 16-TSSOP |
| 包裝： | 帶卷 (TR) |
3
FN6097.3
November 17, 2004
Absolute Maximum Ratings
Thermal Information
V+ to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to 4.7V
Input Voltages
INH, Ax, Bx, ADDx (Note 2) . . . . . . . . . . . . . . -0.3 to (V+) + 0.3V
Output Voltages
COMx (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to (V+) + 0.3V
Continuous Current NO or COM . . . . . . . . . . . . . . . . . . . . .
±300mA
Peak Current NO or COM
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . . . . . .
±500mA
ESD Rating
HBM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >4kV
Thermal Resistance (Typical, Note 3)
θJA (°C/W)
16 Ld TSSOP Package . . . . . . . . . . . . . . . . . . . . . .
150
16 Ld 3x3 QFN Thin Package . . . . . . . . . . . . . . . . .
75
Maximum Junction Temperature (Plastic Package). . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . . . . . . -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C
(Lead Tips Only)
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to 85°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
2. Signals on Ax, Bx, COMx, ADDx, or INH exceeding V+ or GND are clamped by internal diodes. Limit forward diode current to maximum current
ratings.
3.
θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications - 3V Supply Test Conditions: VSUPPLY = +2.7V to +3.3V, GND = 0V, VINH = 1.4V, VINL = 0.5V (Notes 4, 8),
Unless Otherwise Specified
PARAMETER
TEST CONDITIONS
TEMP
(°C)
(NOTE 5)
MIN
TYP
(NOTE 5)
MAX
UNITS
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG
Full
0
-
V+
V
ON Resistance, RON
V+ = 2.7V, ICOM = 100mA, VAX or VBX = 0V to V+,
(See Figure 5)
25
-
0.5
0.75
Full
-
0.8
RON Matching Between Channels,
RON
V+ = 2.7V, ICOM = 100mA, VAX or VBX = Voltage at max
RON, (Note 6)
25
-
0.12
0.2
Full
-
0.2
RON Flatness, RFLAT(ON)
V+ = 2.7V, ICOM = 100mA, VAX or VBX = 0V to V+,
(Note 7)
25
-
0.056
0.15
Full
-
0.15
Ax or Bx OFF Leakage Current,
IAx(OFF) or IBx(OFF)
V+ = 3.3V, VCOM = 0.3V, 3V, VAX or VBX = 3V, 0.3V
25
-4
-
4
nA
Full
-30
-
30
nA
COM ON Leakage Current, ICOM(ON) V+ = 3.3V, VCOM = VAX or VBX = 0.3V, 3V
25
-8
-
8
nA
Full
-60
-
60
nA
DIGITAL INPUT CHARACTERISTICS
Input Voltage High, VINH, VADDH
Full
1.4
-
V
Input Voltage Low, VINL, VADDL
Full
-
0.5
V
Input Current, IINH, IINL, IADDH, IADDL V+ = 3.6V, VINH = VADD = 0V or V+ (Note 10)
Full
-0.5
-
0.5
A
DYNAMIC CHARACTERISTICS
Inhibit Turn-ON Time, tON
V+ = 2.7V, VAx or VBx = 1.5V, RL = 50, CL = 35pF,
(See Figure 1, Note 10)
25
-
16
25
ns
Full
-
27
ns
Inhibit Turn-OFF Time, tOFF
V+ = 2.7V, VAx or VBx = 1.5V, RL = 50, CL = 35pF,
(See Figure 1, Note 10)
25
-
14
23
ns
Full
-
25
ns
Address Transition Time, tTRANS
V+ = 2.7V, VAX or VBX = 1.5V, RL = 50, CL = 35pF,
(See Figure 1, Note 10)
25
-
19
28
ns
Full
-
30
ns
Break-Before-Make Time, tBBM
V+ = 3.3V, VAX or VBX = 1.5V, RL = 50, CL = 35pF,
(See Figure 3, Note 10)
25
-
4
-
ns
Full
1
-
ns
ISL84782
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