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參數(shù)資料
| 型號： | ISL8483EIB |
| 廠商： | Intersil |
| 文件頁數(shù)： | 9/14頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC TXRX RS-485/422 ESD 8-SOIC |
| 標(biāo)準(zhǔn)包裝： | 98 |
| 類型： | 收發(fā)器 |
| 驅(qū)動器/接收器數(shù)： | 1/1 |
| 規(guī)程： | RS422，RS485 |
| 電源電壓： | 4.5 V ~ 5.5 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-SOIC（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 8-SOICN |
| 包裝： | 管件 |
4
FN6048.9
September 9, 2008
Absolute Maximum Ratings
Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V)
Input/Output Voltages
A/Y, B/Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +12.5V
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V)
Short Circuit Duration
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Operating Conditions
Temperature Range
ISL8485ECx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
ISL848xEIx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
ISL8485EAx . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +125°C
ISL8485EMx. . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Thermal Resistance (Typical, Note 1)
θ
JA (°C/W)
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .
170
8 Ld PDIP Package* . . . . . . . . . . . . . . . . . . . . . . . .
140
Maximum Junction Temperature (Plastic Package) . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . -65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in reflow solder processing
applications.
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTE:
1.
θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified.
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
(°C)
MIN
(Note 12)
TYP
MAX
(Note 12) UNITS
DC CHARACTERISTICS
Driver Differential VOUT (no load)
VOD1
Full
-
VCC
V
Driver Differential VOUT (with load)
VOD2
R = 50
Ω (RS-422), (Figure1)
Full
2
3
-
V
R = 27
Ω (RS-485), (Figure 1)
Full
1.5
2.3
5
V
Change in Magnitude of Driver
Differential VOUT for
Complementary Output States
ΔVOD
R = 27
Ω or 50Ω, (Figure 1)
Full
-
0.01
0.2
V
Driver Common-Mode VOUT
VOC
R = 27
Ω or 50Ω, (Figure 1)
Full
-
3
V
Change in Magnitude of Driver
Common-Mode VOUT for
Complementary Output States
ΔV
OC
R = 27
Ω or 50Ω, (Figure 1)
Full
-
0.01
0.2
V
Logic Input High Voltage
VIH
DE, DI, RE
Full
2
-
V
Logic Input Low Voltage
VIL
DE, DI, RE
Full
-
0.8
V
Logic Input Current
IIN1
DE, DI, RE (ISL8483E)
Full
-2
-
2
A
IIN1
DI (ISL8485E)
Full
-2
-
2
A
IIN1
DE,
RE (ISL8485E)
Full
-25
-
25
A
Input Current (A, B), (Note 10)
IIN2
DE = 0V, VCC = 0V or 4.5 to
5.5V
VIN = 12V
Full
-
1
mA
VIN = -7V
Full
-
-0.8
mA
Receiver Differential Threshold
Voltage
VTH
-7V
≤ VCM ≤ 12V
Full
-0.2
-
0.2
V
Receiver Input Hysteresis
ΔV
TH
VCM = 0V
25
-
70
-
mV
Receiver Output High Voltage
VOH
IO = -4mA, VID = 200mV
Full
3.5
-
V
Receiver Output Low Voltage
VOL
IO = -4mA, VID = 200mV
Full
-
0.4
V
Three-State (high impedance)
Receiver Output Current
IOZR
0.4V
≤ V
O ≤ 2.4V
Full
-
±1A
Receiver Input Resistance
RIN
-7V
≤ VCM ≤ 12V
Full
12
-
k
Ω
ISL8483E, ISL8485E
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