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鍙冩暩(sh霉)璩囨枡
| 鍨嬭櫉锛� | ISL8485CBZ |
| 寤犲晢锛� | Intersil |
| 鏂囦欢闋佹暩(sh霉)锛� | 12/16闋� |
| 鏂囦欢澶�?銆�?/td> | 0K |
| 鎻忚堪锛� | IC TXRX RS485/422 5V ESD 8-SOIC |
| 妯欐簴鍖呰锛� | 980 |
| 椤炲瀷锛� | 鏀剁櫦(f膩)鍣� |
| 椹�(q奴)鍕曞櫒/鎺ユ敹鍣ㄦ暩(sh霉)锛� | 1/1 |
| 瑕�(gu墨)绋嬶細 | RS422锛孯S485 |
| 闆绘簮闆诲锛� | 4.5 V ~ 5.5 V |
| 瀹夎椤炲瀷锛� | 琛ㄩ潰璨艰 |
| 灏佽/澶栨锛� | 8-SOIC锛�0.154"锛�3.90mm 瀵級 |
| 渚涙噳鍟嗚ō鍌欏皝瑁濓細 | 8-SOICN |
| 鍖呰锛� | 绠′欢 |
5
FN6046.8
February 28, 2006
Absolute Maximum Ratings
Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V)
Input/Output Voltages
A, B, Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +12.5V
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V)
Short Circuit Duration
Y, Z. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating
HBM (Per MIL-STD-883, Method 3015.7) . . . . . . . . . . . . . . >7kV
Operating Conditions
Temperature Range
ISL84XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0掳C to 70掳C
ISL84XXIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40掳C to 85掳C
Thermal Resistance (Typical, Note 1)
胃
JA (掳C/W)
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .
170
8 Ld PDIP Package* . . . . . . . . . . . . . . . . . . . . . . . .
140
14 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
120
14 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .
100
Moisture Sensitivity (see Technical Brief TB363)
All Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1
Maximum Junction Temperature (Plastic Package) . . . . . . . 150掳C
Maximum Storage Temperature Range . . . . . . . . . . -65掳C to 150掳C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300掳C
(SOIC - Lead Tips Only)
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in Reflow solder processing
applications.
CAUTION: Stresses above those listed in 鈥淎bsolute Maximum Ratings鈥� may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1.
胃JA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified.
Typicals are at VCC = 5V, TA = 25掳C, Note 2
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
(掳C)
MIN
TYP
MAX
UNITS
DC CHARACTERISTICS
Driver Differential VOUT (no load)
VOD1
Full
-
VCC
V
Driver Differential VOUT (with load)
VOD2
R = 50
(RS-422), Figure 1
Full
2
3
-
V
R = 27
(RS-485), Figure 1
Full
1.5
2.3
5
V
Change in Magnitude of Driver
Differential VOUT for
Complementary Output States
V
OD
R = 27
or 50, Figure 1
Full
-
0.01
0.2
V
Driver Common-Mode VOUT
VOC
R = 27
or 50, Figure 1
Full
-
3
V
Change in Magnitude of Driver
Common-Mode VOUT for
Complementary Output States
VOC
R = 27
or 50, Figure 1
Full
-
0.01
0.2
V
Logic Input High Voltage
VIH
DE, DI, RE
Full
2
-
V
Logic Input Low Voltage
VIL
DE, DI, RE
Full
-
0.8
V
Logic Input Current
IIN1
DE, DI, RE (ISL8483)
Full
-2
-
2
A
IIN1
DI (ISL8485 - ISL8491)
Full
-2
-
2
A
IIN1
DE, RE (ISL8485, ISL8489, ISL8491)
Full
-25
-
25
A
Input Current (A, B), Note 10
IIN2
DE = 0V, VCC = 0V or
4.5 to 5.5V
VIN = 12V
Full
-
1
mA
VIN = -7V
Full
-
-0.8
mA
Receiver Differential Threshold
Voltage
VTH
-7V
鈮� VCM 鈮� 12V
Full
-0.2
-
0.2
V
Receiver Input Hysteresis
VTH
VCM = 0V
25
-
70
-
mV
Receiver Output High Voltage
VOH
IO = -4mA, VID = 200mV
Full
3.5
-
V
Receiver Output Low Voltage
VOL
IO = -4mA, VID = 200mV
Full
-
0.4
V
Three-State (high impedance)
Receiver Output Current
IOZR
0.4V
鈮� VO 鈮� 2.4V
Full
-
卤1
A
ISL8483, ISL8485, ISL8488, ISL8489, ISL8490, ISL8491
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