參數(shù)資料
型號(hào): ISL8491EIB-T
廠商: Intersil
文件頁(yè)數(shù): 4/13頁(yè)
文件大?。?/td> 0K
描述: IC TXRX RS485/422 5V ESD 14SOIC
標(biāo)準(zhǔn)包裝: 2,500
類(lèi)型: 收發(fā)器
驅(qū)動(dòng)器/接收器數(shù): 1/1
規(guī)程: RS422,RS485
電源電壓: 4.5 V ~ 5.5 V
安裝類(lèi)型: 表面貼裝
封裝/外殼: 14-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 14-SOICN
包裝: 帶卷 (TR)
12
FN6073.4
July 26, 2007
ISL8488E, ISL8489E, ISL8490E, ISL8491E
Small Outline Plastic Packages (SOIC)
INDEX
AREA
E
D
N
12
3
-B-
0.25(0.010)
C A
M
BS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45°
C
H
0.25(0.010)
B
M
α
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
M8.15 (JEDEC MS-012-AA ISSUE C)
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.1890
0.1968
4.80
5.00
3
E
0.1497
0.1574
3.80
4.00
4
e
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N8
8
7
α
-
Rev. 1 6/05
相關(guān)PDF資料
PDF描述
ISL8491IP IC TXRX RS485/422 5V ESD 14-DIP
ISL8499IV-T IC SWITCH QUAD SPDT 16TSSOP
ISL8563ECB-T XMITTER/RCVR RS562/232 18-SOIC
ISL88694IH5-TK IC SMBUS ACCELERATOR SOT23-5
ISL90460WIH527-TK IC XDCP 32-TAP 10KOHMS SOT23-5
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISL8491EIBZ 功能描述:RS-422/RS-485 接口 IC LD 14LD -40+85 5V RS 485 TRANSC 1TX/1RX RoHS:否 制造商:Maxim Integrated 數(shù)據(jù)速率:1136 Kbps 工作電源電壓:3 V to 5.5 V 電源電流:5.9 mA 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-28 封裝:Tube
ISL8491EIBZ-T 功能描述:IC TXRX RS485/422 5V ESD 14SOIC RoHS:是 類(lèi)別:集成電路 (IC) >> 接口 - 驅(qū)動(dòng)器,接收器,收發(fā)器 系列:- 標(biāo)準(zhǔn)包裝:250 系列:- 類(lèi)型:收發(fā)器 驅(qū)動(dòng)器/接收器數(shù):2/2 規(guī)程:RS232 電源電壓:3 V ~ 5.5 V 安裝類(lèi)型:表面貼裝 封裝/外殼:16-TSSOP(0.173",4.40mm 寬) 供應(yīng)商設(shè)備封裝:16-TSSOP 包裝:帶卷 (TR)
ISL8491IB 功能描述:IC TXRX RS485/422 5V ESD 14SOIC RoHS:否 類(lèi)別:集成電路 (IC) >> 接口 - 驅(qū)動(dòng)器,接收器,收發(fā)器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:25 系列:- 類(lèi)型:收發(fā)器 驅(qū)動(dòng)器/接收器數(shù):2/2 規(guī)程:RS232 電源電壓:4.5 V ~ 5.5 V 安裝類(lèi)型:通孔 封裝/外殼:16-DIP(0.300",7.62mm) 供應(yīng)商設(shè)備封裝:16-PDIP 包裝:管件
ISL8491IB-T 功能描述:IC TXRX RS485/422 5V ESD 14SOIC RoHS:否 類(lèi)別:集成電路 (IC) >> 接口 - 驅(qū)動(dòng)器,接收器,收發(fā)器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:25 系列:- 類(lèi)型:收發(fā)器 驅(qū)動(dòng)器/接收器數(shù):2/2 規(guī)程:RS232 電源電壓:4.5 V ~ 5.5 V 安裝類(lèi)型:通孔 封裝/外殼:16-DIP(0.300",7.62mm) 供應(yīng)商設(shè)備封裝:16-PDIP 包裝:管件
ISL8491IBZ 功能描述:TXRX RS-485/422 5V LP 14-SOIC RoHS:是 類(lèi)別:集成電路 (IC) >> 接口 - 驅(qū)動(dòng)器,接收器,收發(fā)器 系列:- 標(biāo)準(zhǔn)包裝:250 系列:- 類(lèi)型:收發(fā)器 驅(qū)動(dòng)器/接收器數(shù):2/2 規(guī)程:RS232 電源電壓:3 V ~ 5.5 V 安裝類(lèi)型:表面貼裝 封裝/外殼:16-TSSOP(0.173",4.40mm 寬) 供應(yīng)商設(shè)備封裝:16-TSSOP 包裝:帶卷 (TR)