All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certificatio" />
參數(shù)資料
型號(hào): ISL90460TIH527-TK
廠商: Intersil
文件頁(yè)數(shù): 7/7頁(yè)
文件大小: 0K
描述: IC XDCP 32-TAP 100KOHMS SOT23-5
標(biāo)準(zhǔn)包裝: 1,000
系列: XDCP™
接片: 32
電阻(歐姆): 100k
電路數(shù): 1
溫度系數(shù): 標(biāo)準(zhǔn)值 ±35 ppm/°C
存儲(chǔ)器類型: 易失
接口: 2 線串行(芯片選擇,增/減)
電源電壓: 2.7 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: SC-74A,SOT-753
供應(yīng)商設(shè)備封裝: SOT-23-5
包裝: 帶卷 (TR)
7
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN8225.3
October 7, 2005
ISL90460
Small Outline Transistor Plastic Packages (SC70-5)
D
e1
E
E1
C
L
C
L
e
b
C
L
A2
A
A1
C
L
0.20 (0.008) M
0.10 (0.004) C
C
-C-
SEATING
PLANE
4
5
12
3
VIEW C
L
R1
R
4X
θ1
4X
θ1
GAUGE PLANE
L1
SEATING
α
L2
C
PLANE
c
BASE METAL
WITH
c1
b1
PLATING
b
P5.049
5 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.031
0.043
0.80
1.10
-
A1
0.000
0.004
0.00
0.10
-
A2
0.031
0.039
0.80
1.00
-
b
0.006
0.012
0.15
0.30
-
b1
0.006
0.010
0.15
0.25
c
0.003
0.009
0.08
0.22
6
c1
0.003
0.009
0.08
0.20
6
D
0.073
0.085
1.85
2.15
3
E
0.071
0.094
1.80
2.40
-
E1
0.045
0.053
1.15
1.35
3
e
0.0256 Ref
0.65 Ref
-
e1
0.0512 Ref
1.30 Ref
-
L
0.010
0.018
0.26
0.46
4
L1
0.017 Ref.
0.420 Ref.
-
L2
0.006 BSC
0.15 BSC
α
0o
8o
0o
8o
-
N5
5
R
0.004
-
0.10
-
R1
0.004
0.010
0.15
0.25
Rev. 2 9/03
NOTES:
1. Dimensioning and tolerances per ASME Y14.5M-1994.
2. Package conforms to EIAJ SC70 and JEDEC MO-203AA.
3. Dimensions D and E1 are exclusive of mold flash, protrusions,
or gate burrs.
4. Footlength L measured at reference to gauge plane.
5. “N” is the number of terminal positions.
6. These Dimensions apply to the flat section of the lead between
0.08mm and 0.15mm from the lead tip.
7. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are for reference only.
相關(guān)PDF資料
PDF描述
VE-271-MY-F2 CONVERTER MOD DC/DC 12V 50W
ISL90460TIE527-TK IC XDCP 32-TAP 100KOHMS SC70-5
VE-2NV-MW-S CONVERTER MOD DC/DC 5.8V 100W
X9252TV24IZ-2.7 IC POT DGTL QUAD 100KOHM 24TSSOP
X9252UV24IZ-2.7 IC POT DGTL QUAD 50K OHM 24TSSOP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISL90460TIH527Z-TK 功能描述:IC XDCP 32-TAP 100KOHMS SOT23-5 RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 標(biāo)準(zhǔn)包裝:3,000 系列:DPP 接片:32 電阻(歐姆):10k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 300 ppm/°C 存儲(chǔ)器類型:非易失 接口:3 線串行(芯片選擇,遞增,增/減) 電源電壓:2.5 V ~ 6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-WFDFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:8-TDFN(2x3) 包裝:帶卷 (TR)
ISL90460UIE527 功能描述:IC XDCP 32-TAP 50KOHMS SC70-5 RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 標(biāo)準(zhǔn)包裝:2,500 系列:XDCP™ 接片:256 電阻(歐姆):100k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 ±300 ppm/°C 存儲(chǔ)器類型:非易失 接口:I²C(設(shè)備位址) 電源電壓:2.7 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:14-TSSOP(0.173",4.40mm 寬) 供應(yīng)商設(shè)備封裝:14-TSSOP 包裝:帶卷 (TR)
ISL90460UIE527-TK 功能描述:IC XDCP 32-TAP 50KOHMS SC70-5 RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 標(biāo)準(zhǔn)包裝:2,500 系列:XDCP™ 接片:256 電阻(歐姆):100k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 ±300 ppm/°C 存儲(chǔ)器類型:非易失 接口:I²C(設(shè)備位址) 電源電壓:2.7 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:14-TSSOP(0.173",4.40mm 寬) 供應(yīng)商設(shè)備封裝:14-TSSOP 包裝:帶卷 (TR)
ISL90460UIE527Z-TK 功能描述:IC XDCP 32-TAP 50KOHMS SC70-5 RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 標(biāo)準(zhǔn)包裝:3,000 系列:DPP 接片:32 電阻(歐姆):10k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 300 ppm/°C 存儲(chǔ)器類型:非易失 接口:3 線串行(芯片選擇,遞增,增/減) 電源電壓:2.5 V ~ 6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-WFDFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:8-TDFN(2x3) 包裝:帶卷 (TR)
ISL90460UIH527-TK 功能描述:IC XDCP 32-TAP 50KOHMS SOT23-5 RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 標(biāo)準(zhǔn)包裝:2,500 系列:XDCP™ 接片:256 電阻(歐姆):100k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 ±300 ppm/°C 存儲(chǔ)器類型:非易失 接口:I²C(設(shè)備位址) 電源電壓:2.7 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:14-TSSOP(0.173",4.40mm 寬) 供應(yīng)商設(shè)備封裝:14-TSSOP 包裝:帶卷 (TR)