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參數(shù)資料
| 型號： | ISP1109 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Universal Serial Bus transceiver with carkit support |
| 中文描述： | 與車載通用串行總線收發(fā)器支持 |
| 文件頁數(shù)： | 51/59頁 |
| 文件大?。?/td> | 295K |
| 代理商： | ISP1109 |
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9397 750 13355
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 14 July 2005
51 of 59
Philips Semiconductors
ISP1109
USB transceiver with carkit support
–
smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45
°
angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250
°
C
or 265
°
C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.
19.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300
°
C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270
°
C and 320
°
C.
19.5 Package related soldering information
[1]
For more detailed information on the BGA packages refer to the (LF)BGA Application Note(AN01026);
order a copy from your Philips Semiconductors sales office.
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
Table 63:
Package
[1]
Suitability of surface mount IC packages for wave and reflow soldering methods
Soldering method
Wave
BGA, HTSSON..T
[3]
, LBGA, LFBGA, SQFP,
SSOP..T
[3]
, TFBGA, VFBGA, XSON
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
PLCC
[5]
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L
[8]
, PMFP
[9]
, WQCCN..L
[8]
Reflow
[2]
suitable
not suitable
not suitable
[4]
suitable
suitable
not recommended
[5] [6]
not recommended
[7]
not suitable
suitable
suitable
suitable
not suitable
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ISP1109BS | Universal Serial Bus transceiver with carkit support |
| ISP1122A | Universal Serial Bus stand-alone hub |
| ISP1122ABD | Universal Serial Bus stand-alone hub |
| ISP1122AD | Universal Serial Bus stand-alone hub |
| ISP1122ANB | Universal Serial Bus stand-alone hub |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISP1109BS | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Universal Serial Bus transceiver with carkit support |
| ISP1109BS,118 | 功能描述:射頻收發(fā)器 USB FS TRANSCVR RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數(shù)據(jù)速率:2000 Kbps 調(diào)制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
| ISP1109BS,151 | 功能描述:射頻收發(fā)器 DO NOT USE ORDER -T PART RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數(shù)據(jù)速率:2000 Kbps 調(diào)制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
| ISP1109BS,157 | 功能描述:射頻收發(fā)器 DO NOT USE ORDER -T PART RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數(shù)據(jù)速率:2000 Kbps 調(diào)制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
| ISP1109BSFE | 功能描述:IC TXRX SERIAL BUS UNIV 32HVQFN RoHS:是 類別:集成電路 (IC) >> 接口 - 驅(qū)動器，接收器，收發(fā)器 系列:- 標(biāo)準(zhǔn)包裝:2,500 系列:- 類型:驅(qū)動器 驅(qū)動器/接收器數(shù):4/0 規(guī)程:RS422 電源電壓:4.5 V ~ 5.5 V 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:16-SOIC N 包裝:帶卷 (TR) |
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