參數(shù)資料
型號(hào)： ISP1520BD,557
廠商： NXP SEMICONDUCTORS
元件分類： 總線控制器
英文描述： UNIVERSAL SERIAL BUS CONTROLLER, PQFP64
封裝： 10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-314-2, LQFP-64
文件頁(yè)數(shù)： 44/54頁(yè)
文件大?。?/td> 288K
代理商： ISP1520BD,557
ISP1520_4
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 04 — 28 April 2006
48 of 53
Philips Semiconductors
ISP1520
Hi-Speed USB hub controller
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
denitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on ex foil. However, the image sensor package can be mounted by the client on a ex foil by
using a hot bar soldering process. The appropriate soldering prole can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
20. Abbreviations
21. References
[1]
Universal Serial Bus Specication Rev. 2.0
[2]
The I2C-bus specication
[3]
ISP1520 Hub Demo Board User’s Guide
Table 48.
Abbreviations
Acronym
Description
ACPI
Advanced Conguration and Power Interface
CRC
Cyclical Redundancy Check
EEPROM
Electronically Erasable Programmable Read-Only Memory
EMI
ElectroMagnetic Interference
EOP
End-of-Packet
ESD
ElectroStatic Discharge
FET
Field-Effect Transistor
HS
High-Speed
LSB
Least Signicant Bit
MSB
Most Signicant Bit
MOSFET
Metal Oxide Silicon Field Effect Transistor
NAK
Not AcKnowledge
PCB
Printed-Circuit Board
PID
Packet IDentier
PLL
Phase-Locked Loop
SIE
Serial Interface Engine
SOP
Start-of-Packet
TT
Transaction Translator
TTL
Transistor-Transistor Logic
USB
Universal Serial Bus
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PDF描述
ISP1520BD,557 UNIVERSAL SERIAL BUS CONTROLLER, PQFP64
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISP1520BDGA 功能描述:IC USB HUB CONTROLLER HS 64-LQFP RoHS:是 類別:集成電路 (IC) >> 接口 - 專用 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 應(yīng)用:PDA，便攜式音頻/視頻，智能電話 接口:I²C，2 線串口 電源電壓:1.65 V ~ 3.6 V 封裝/外殼:24-WQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:24-QFN 裸露焊盤（4x4） 包裝:帶卷 (TR) 安裝類型:表面貼裝 產(chǎn)品目錄頁(yè)面:1015 (CN2011-ZH PDF) 其它名稱:296-25223-2
ISP1520BD-S 制造商:ST-Ericsson 功能描述:Universal Serial Bus Hub Controller 64-Pin LQFP
ISP1520BD-T 功能描述:USB 接口集成電路 USB2 4 PORT HUB RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
ISP1520BDUM 功能描述:IC USB HUB CONTROLLER HS 64-LQFP RoHS:是 類別:集成電路 (IC) >> 接口 - 專用 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 應(yīng)用:PDA，便攜式音頻/視頻，智能電話 接口:I²C，2 線串口 電源電壓:1.65 V ~ 3.6 V 封裝/外殼:24-WQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:24-QFN 裸露焊盤（4x4） 包裝:帶卷 (TR) 安裝類型:表面貼裝 產(chǎn)品目錄頁(yè)面:1015 (CN2011-ZH PDF) 其它名稱:296-25223-2
ISP1521 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:IC USB HUB CONTROLLER HS 80-LQFP
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