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參數(shù)資料
| 型號： | IXDN402SIA-16 |
| 廠商： | IXYS CORP |
| 元件分類： | 外設(shè)及接口 |
| 英文描述： | 2 Ampere Dual Low-Side Ultrafast MOSFET Drivers |
| 中文描述： | 2 A 2 CHANNEL, BUF OR INV BASED PRPHL DRVR, PDSO16 |
| 封裝： | 0.300 INCH, MS-013AA, SOIC-16 |
| 文件頁數(shù)： | 9/10頁 |
| 文件大?。?/td> | 308K |
| 代理商： | IXDN402SIA-16 |
9
IXDN402 / IXDI402 / IXDF402
PIN CONFIGURATIONS
1
2
3
4
5
6
7
8
IN A
GND
INB
OUT A
V
S
OUT B
NC
NC
8 Lead PDIP (PI)
8 Pin SOIC (SI)
IXDN402
1
2
3
4
5
6
7
8
IN A
GND
INB
OUT A
V
S
OUT B
NC
NC
8 Lead PDIP (PI)
8 Pin SOIC (SI)
IXDI402
16 Pin SOIC
IXDN402SI-16
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
NC
IN A
NC
GND
GND
NC
IN B
NC
NC
OUT B
OUT B
VCC
VCC
OUT A
OUT A
NC
1
2
3
4
5
6
7
8
IN A
GND
INB
OUT A
V
S
OUT B
NC
NC
8 Lead PDIP (PI)
8 Pin SOIC (SI)
IXDF402
16 Pin SOIC
IXDI402SI-16
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
NC
IN A
NC
GND
GND
NC
IN B
NC
NC
OUT B
OUT B
VCC
VCC
OUT A
OUT A
NC
16 Pin SOIC
IXDF402SI-16
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
NC
IN A
NC
GND
GND
NC
IN B
NC
NC
OUT B
OUT B
VCC
VCC
OUT A
OUT A
NC
When designing a circuit to drive a high speed MOSFET
utilizing the IXDN402/IXDI402/IXDF402, it is very important to
observe certain design criteria in order to optimize performance
of the driver. Particular attention needs to be paid to
Supply
Bypassing
,
Grounding
, and minimizing the
Output Lead
Inductance
.
Say, for example, we are using the IXDN402 to charge a 1500pF
capacitive load from 0 to 25 volts in 25ns
.
Using the formula: I=
V C /
t, where
V=25V C=1500pF &
t=25ns, we can determine that to charge 1500pF to 25 volts
in 25ns will take a constant current of 1.5A. (In reality, the
charging current won’t be constant, and will peak somewhere
around 2A).
SUPPLY BYPASSING
In order for our design to turn the load on properly, the IXDN402
must be able to draw this 1.5A of current from the power supply
in the 25ns. This means that there must be very low impedance
between the driver and the power supply. The most common
method of achieving this low impedance is to bypass the power
supply at the driver with a capacitance value that is an order of
magnitude larger than the load capacitance. Usually, this
would be achieved by placing two different types of bypassing
capacitors, with complementary impedance curves, very close
to the driver itself. (These capacitors should be carefully
selected and should have low inductance, low resistance and
high-pulse current-service ratings). Lead lengths may radiate
at high frequency due to inductance, so care should be taken
to keep the lengths of the leads between these bypass
capacitors and the IXDN402 to an absolute minimum.
GROUNDING
In order for the design to turn the load off properly, the IXDN402
must be able to drain this 1.5A of current into an adequate
grounding system. There are three paths for returning current
that need to be considered: Path #1 is between the IXDN402
and its load. Path #2 is between the IXDN402 and its power
supply. Path #3 is between the IXDN402 and whatever logic is
driving it. All three of these paths should be as low in resistance
and inductance as possible, and thus as short as practical. In
addition, every effort should be made to keep these three
ground paths distinctly separate. Otherwise, the returning
ground current from the load may develop a voltage that would
have a detrimental effect on the logic line driving the IXDN402.
OUTPUT LEAD INDUCTANCE
Of equal importance to Supply Bypassing and Grounding are
issues related to the Output Lead Inductance. Every effort
should be made to keep the leads between the driver and its
load as short and wide as possible. If the driver must be placed
farther than 2” (5mm) from the load, then the output leads
should be treated as transmission lines. In this case, a twisted-
pair should be considered, and the return line of each twisted
pair should be placed as close as possible to
the ground pin
of the driver, and connected directly to the ground terminal
of the load.
Supply Bypassing, Grounding Practices And Output Lead inductance
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| IXDI402PI | 2 Ampere Dual Low-Side Ultrafast MOSFET Drivers |
| IXDI402SI | 2 Ampere Dual Low-Side Ultrafast MOSFET Drivers |
| IXDI402SI-16 | GT 14C 14#16 SKT PLUG RTANG |
| IXDI402SIA | 2 Ampere Dual Low-Side Ultrafast MOSFET Drivers |
| IXDI402SIA-16 | Circular Connector; MIL SPEC:MIL-C-5015; Body Material:Metal; Series:GT; No. of Contacts:17; Connector Shell Size:20; Connecting Termination:Crimp; Circular Shell Style:Right Angle Plug; Body Style:Right Angle |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| IXDN404 | 制造商:IXYS 制造商全稱:IXYS Corporation 功能描述:4 Ampere Dual Low-Side Ultrafast MOSFET Drivers |
| IXDN404_04 | 制造商:IXYS 制造商全稱:IXYS Corporation 功能描述:4 Ampere Dual Low-Side Ultrafast MOSFET Drivers |
| IXDN404PI | 功能描述:功率驅(qū)動器IC 40V 4A RoHS:否 制造商:Micrel 產(chǎn)品:MOSFET Gate Drivers 類型:Low Cost High or Low Side MOSFET Driver 上升時間: 下降時間: 電源電壓-最大:30 V 電源電壓-最小:2.75 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| IXDN404SI | 功能描述:功率驅(qū)動器IC 40V 4A RoHS:否 制造商:Micrel 產(chǎn)品:MOSFET Gate Drivers 類型:Low Cost High or Low Side MOSFET Driver 上升時間: 下降時間: 電源電壓-最大:30 V 電源電壓-最小:2.75 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| IXDN404SI-16 | 功能描述:功率驅(qū)動器IC 40V 4A RoHS:否 制造商:Micrel 產(chǎn)品:MOSFET Gate Drivers 類型:Low Cost High or Low Side MOSFET Driver 上升時間: 下降時間: 電源電壓-最大:30 V 電源電壓-最小:2.75 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
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