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| 型號(hào)： | JAHW075F |
| 英文描述： | Analog IC |
| 中文描述： | 模擬IC |
| 文件頁(yè)數(shù)： | 13/16頁(yè) |
| 文件大?。?/td> | 345K |
| 代理商： | JAHW075F |
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Lucent Technologies Inc.
13
Data Sheet
June 2000
dc-dc Converters; 36 Vdc to 75 Vdc Input, 5 Vdc Output; 50 W to 75 W
JAHW050A and JAHW075A Power Modules:
Thermal Considerations
(continued)
Heat Transfer with Heat Sinks
(continued)
8-2239 (F)
Figure 24. JAHW050A and JAHW075A Case-to-
Ambient Thermal Resistance Curves;
Either Orientation
These measured resistances are from heat transfer
from the sides and bottom of the module as well as the
top side with the attached heat sink; therefore, the
case-to-ambient thermal resistances shown are gener-
ally lower than the resistance of the heat sink by itself.
The module used to collect the data in Figure 24 had a
thermal-conductive dry pad between the case and the
heat sink to minimize contact resistance. The use of
Figure 24 is shown in the following example.
Example
If an 85 °C case temperature is desired, what is the
minimum airflow necessary Assume the JAHW075A
module is operating at V
I
= 55 V and an output
current of 15 A, maximum ambient air temperature of
55 °C, and the heat sink is 1/2 inch.
Solution
Given: V
I
= 55 V
I
O
= 15 A
T
A
= 55 °C
T
C
= 85 °C
Heat sink = 1/2 inch
Determine P
D
by using Figure 23:
P
D
= 8 W
Then solve the following equation:
Use Figure 24 to determine air velocity for the 1/2 inch
heat sink.
The minimum airflow necessary for the JAHW075A
module is 0.5 m/s (100 ft./min.).
Custom Heat Sinks
A more detailed model can be used to determine the
required thermal resistance of a heat sink to provide
necessary cooling. The total module resistance can be
separated into a resistance from case-to-sink (
θ
cs) and
sink-to-ambient (
θ
sa) as shown in Figure 25.
8-1304 (F).e
Figure 25. Resistance from Case-to-Sink and
Sink-to-Ambient
For a managed interface using thermal grease or foils,
a value of
θ
cs = 0.1 °C/W to 0.3 °C/W is typical. The
solution for heat sink resistance is:
This equation assumes that all dissipated power must
be shed by the heat sink. Depending on the user-
defined application environment, a more accurate
model, including heat transfer from the sides and bot-
tom of the module, can be used. This equation pro-
vides a conservative estimate for such instances.
EMC Considerations
For assistance with designing for EMC compliance,
please refer to the FLTR100V10 data sheet
(DS99-294EPS).
Layout Considerations
Copper paths must not be routed beneath the power
module standoffs. For additional layout guidelines, refer
to the FLTR100V10 data sheet (DS99-294EPS).
2.0
(400)
AIR VELOCITY, m/s (ft./min.)
C
2.5
(500) (600)
3.0
1.5
(300)
8.00
7.00
1.0
(200)
0.5
(100)
0
6.00
5.00
4.00
3.00
2.00
1.00
0.00
R
θ
c
°
C
1 1/2 IN. HEAT SINK
1 IN. HEAT SINK
1/2 IN. HEAT SINK
1/4 IN. HEAT SINK
NO HEAT SINK
θ
ca
T
------------------------
T
(
)
P
D
–
8
=
θ
ca
-85
55
(
)
=
θ
ca
3.8 °C/W
=
P
D
T
C
T
S
T
A
θ
cs
θ
sa
θ
sa
C
-T
T
A
–
(
)
P
D
θ
cs
–
=
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| JAHW075S6R5 | 制造商:GE Energy 功能描述: |
| JAHW075Y1 | 功能描述:CONVERTER DC/DC 1.8V 27W OUT RoHS:否 類別:電源 - 板載 >> DC DC Converters 系列:JAHW 設(shè)計(jì)資源:VI-200, VI-J00 Design Guide, Appl Manual 標(biāo)準(zhǔn)包裝:1 系列:* 類型:隔離 輸出數(shù):1 電壓 - 輸入（最?。?42V 電壓 - 輸入（最大）:60V Voltage - Output 1:15V Voltage - Output 2:- Voltage - Output 3:- 電流 - 輸出（最大）:* 電源（瓦） - 制造商系列:150W 電壓 - 隔離:* 特點(diǎn):* 安裝類型:通孔 封裝/外殼:9-SlimMod 尺寸/尺寸:4.60" L x 1.80" W x 0.52" H（116.8mm x 45.7mm x 13.2mm） 包裝:散裝 工作溫度:-55°C ~ 85°C 效率:* 電源（瓦特）- 最大:* |
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